S29AL008J70BFI013 Spansion Inc., S29AL008J70BFI013 Datasheet - Page 13

• Manufacturer Part Number: S29AL008J70BFI013
• Description: IC 8M FLASH MEMORY
• Manufacturer: Spansion Inc.

Specifications of S29AL008J70BFI013

• Cell Type: NOR
• Density: 8Mb
• Access Time (max): 70ns
• Interface Type: Parallel
• Boot Type: Top
• Address Bus: 20/19Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: FBGA
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 1M/512K
• Supply Current: 12mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Compliant

6.
6.1
February 23, 2010 S29AL008J_00_09
Ordering Information
S29AL008J Standard Products
Spansion standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the elements below.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Notes
1. Type 0 is standard. Specify other options as required.
2. Type 1 is standard. Specify other options as required.
3. TSOP package markings omit packing type designator from ordering part number.
4. BGA package marking omits leading S29 and packing type designator from ordering part number.
Device Number
S29AL008J
S29AL008J
Option
Speed
70
55
70
Device Number/Description
S29AL008J
8 Megabit Flash Memory manufactured using 110 nm process technology
3.0 Volt-only Read, Program, and Erase
D a t a
T
S29AL008J Valid Combination
Package Type, Material, and
Temperature Range
F
SFI, SFN
BFI, BFN
SFI, SFN
BFI, BFN
TFI, TFN
TFI, TFN
S h e e t
BFN
TFI
I
S29AL008J
01
0
Packing Type
0 = Tray
1 = Tube
2 = 7” Tape and Reel
3 = 13” Tape and Reel
Model Number
01 = V
02 = V
03 = V
04 = V
R1 = V
R2 = V
Temperature Range
I
N = Extended (-40°C to +125°C)
Package Material Set
F = Pb-Free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
S = Shrink Small Outline Package
Speed Option
55 = 55 ns Access Speed
70 = 70 ns Access Speed
Number
R1, R2
Model
01, 02
03, 04
= Industrial (-40°C to +85°C)
CC
CC
CC
CC
CC
CC
= 2.7-3.6V, top boot sector device (CFI Support)
= 2.7-3.6V, bottom boot sector device (CFI Support)
= 2.7-3.6V, top boot sector device (No CFI Support)
= 2.7-3.6V, bottom boot sector device (No CFI Support)
= 3.0-3.6V, top boot sector device (CFI Support)
= 3.0-3.6V, bottom boot sector device (CFI Support)
0, 2, 3
0, 2, 3
0, 2, 3
PackingType
0, 3
0, 3
0, 3
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
(Note 1)
SSOP56
SSOP56
VBK048
VBK048
VBK048
TS048
TS048
TS048
Package Description
(Note 3)
(Note 3)
(Note 3)
(Note 4)
(Note 4)
(Note 4)
(Note 3)
(Note 3)
Fine-Pitch BGA
Fine-Pitch BGA
Fine-Pitch BGA
TSOP
SSOP
TSOP
SSOP
TSOP
13