SST39VF1602C-70-4I-B3KE-T Microchip Technology, SST39VF1602C-70-4I-B3KE-T Datasheet - Page 31
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SST39VF1602C-70-4I-B3KE-T
Manufacturer Part Number
SST39VF1602C-70-4I-B3KE-T
Description
2.7V To 3.6V 16Mbit Multi-Purpose Flash 48 TFBGA 6x8x1.2 Mm T/R
Manufacturer
Microchip Technology
Datasheet
1.SST39VF1602C-70-4C-EKE.pdf
(33 pages)
Specifications of SST39VF1602C-70-4I-B3KE-T
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
16M (1M x 16)
Speed
70ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SST39VF1602C-70-4I-B3KE-T
Manufacturer:
Microchip Technology
Quantity:
10 000
16 Mbit Multi-Purpose Flash Plus
SST39VF1601C / SST39VF1602C
PACKAGING DIAGRAMS
©2010 Silicon Storage Technology, Inc.
Note: 1. Complies with JEDEC publication 95 MO-142 DD dimensions,
FIGURE 27: 48-lead Thin Small Outline Package (TSOP) 12mm x 20mm
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 mm
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
although some dimensions may be more stringent.
0.70
0.50
SST Package Code: EK
Pin # 1 Identifier
18.50
18.30
20.20
19.80
31
12.20
11.80
1.20
max.
DETAIL
1mm
1.05
0.95
S71380-04-000
48-tsop-EK-8
0.15
0.05
0.70
0.50
BSC
0.50
0.27
0.17
Data Sheet
0°- 5°
05/10