SST39VF3201B-70-4I-B3KE Microchip Technology, SST39VF3201B-70-4I-B3KE Datasheet - Page 12
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SST39VF3201B-70-4I-B3KE
Manufacturer Part Number
SST39VF3201B-70-4I-B3KE
Description
2.7V To 3.6V 32Mbit Multi-Purpose Flash 48 TFBGA 6x8x1.2 Mm TRAY
Manufacturer
Microchip Technology
Specifications of SST39VF3201B-70-4I-B3KE
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
32M (2M x 16)
Speed
70ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SST39VF3201B-70-4I-B3KE
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
SST39VF3201B-70-4I-B3KE-T
Manufacturer:
Microchip Technology
Quantity:
10 000
Data Sheet
TABLE 10: DC Operating Characteristics V
TABLE 11: Recommended System Power-up Timings
TABLE 12: Capacitance (TA = 25°C, f=1 Mhz, other pins open)
TABLE 13: Reliability Characteristics
©2009 Silicon Storage Technology, Inc.
Symbol
I
I
I
I
I
I
V
V
V
V
V
V
Symbol
T
T
Parameter
C
C
Symbol
N
T
I
DD
SB
ALP
LI
LIW
LO
LTH
PU-READ
PU-WRITE
DR
IL
ILC
IH
IHC
OL
OH
I/O
IN
END
1. Typical conditions for the Active Current shown on the front page of the data sheet are average values at 25°C
2. See Figure 19
3. The I
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
2. N
1
1
1
1
(room temperature), and V
higher minimum specification.
1,2
END
1
DD
1
endurance rating is qualified as a 10,000 cycle minimum for the whole device. A sector- or block-level rating would result in a
Parameter
Power Supply Current
Read
Program and Erase
Standby V
Auto Low Power
Input Leakage Current
Input Leakage Current
on WP# pin and RST#
Output Leakage Current
Input Low Voltage
Input Low Voltage (CMOS)
Input High Voltage
Input High Voltage (CMOS)
Output Low Voltage
Output High Voltage
current listed is typically less than 2mA/MHz, with OE# at V
3
Parameter
Power-up to Read Operation
Power-up to Program/Erase Operation
Description
I/O Pin Capacitance
Input Capacitance
Parameter
Endurance
Data Retention
Latch Up
DD
Current
DD
= 3V. Not 100% tested.
V
V
0.7V
DD
DD
Min
-0.3
-0.2
DD
DD
Minimum Specification
= 2.7-3.6V
Limits
12
100 + I
Max
0.8
0.3
0.2
10,000
15
45
20
20
10
1
1
100
IH.
1
Typical V
DD
Units
32 Mbit Multi-Purpose Flash Plus
mA
mA
µA
µA
µA
µA
µA
SST39VF3201B / SST39VF3202B
DD
V
V
V
V
V
V
is 3V.
Test Conditions
Address input=V
V
CE#=V
CE#=WE#=V
CE#=V
CE#=V
All inputs=V
V
WP#=GND to V
V
V
V
V
V
I
I
OL
OH
DD
IN
OUT
DD
DD
DD
DD
Cycles
Test Condition
Units
Years
=100 µA, V
=GND to V
=-100 µA, V
mA
=V
=V
=V
=V
=V
Minimum
=GND to V
V
V
I/O
DD
DD
DD
DD
DD
IN
IL
IHC
ILC
100
100
, OE#=WE#=V
= 0V
= 0V
, V
Max
Min
Max
Max
Max
, V
SS
DD
DD
IL
DD
DD
JEDEC Standard A103
JEDEC Standard A117
, OE#=V
or V
=V
DD
=V
JEDEC Standard 78
DD
DD
, V
=V
ILT
=V
DD
DD
, V
/V
DD,
or RST#=GND to V
DD
DD
Test Method
DD
Max
IHT
Max
DD
=V
WE#=V
Min
S71384-01-000
IH
IH
=V
Min
2
DD
, at f=5 MHz,
, all I/Os open
Maximum
DD
Max
10 pF
10 pF
Units
Max
µs
µs
IHC
T10.0 1384
T11.0 1384
T12.0 1384
T13.0 1384
DD
1/09