XC3S500E-4FT256I Xilinx Inc, XC3S500E-4FT256I Datasheet - Page 80
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XC3S500E-4FT256I
Manufacturer Part Number
XC3S500E-4FT256I
Description
FPGA Spartan®-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet
1.XC3S100E-4VQG100C.pdf
(233 pages)
Specifications of XC3S500E-4FT256I
Package
256FTBGA
Family Name
Spartan®-3E
Device Logic Cells
10476
Device Logic Units
1164
Device System Gates
500000
Number Of Registers
9312
Maximum Internal Frequency
572 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
190
Ram Bits
368640
Number Of Logic Elements/cells
10476
Number Of Labs/clbs
1164
Total Ram Bits
368640
Number Of I /o
190
Number Of Gates
500000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-LBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
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Part Number
Manufacturer
Quantity
Price
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XILINX
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Part Number:
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Manufacturer:
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Part Number:
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Functional Description
Table 55: Serial Peripheral Interface (SPI) Connections
80
HSWAP
M[2:0]
VS[2:0]
MOSI
DIN
CSO_B
CCLK
DOUT
INIT_B
Pin Name
P
S
bidirectional
Open-drain
Direction
Output
Output
Output
Output
FPGA
Input
Input
Input
Input
I/O
User I/O Pull-Up Control. When Low
during configuration, enables pull-up
resistors in all I/O pins to respective I/O
bank V
0: Pull-ups during configuration
1: No pull-ups
Mode Select. Selects the FPGA
configuration mode. See
Considerations for the HSWAP,
M[2:0], and VS[2:0]
Variant Select. Instructs the FPGA how
to communicate with the attached SPI
Flash PROM. See
Considerations for the HSWAP,
M[2:0], and VS[2:0]
Serial Data Output.
Serial Data Input.
Chip Select Output. Active Low.
Configuration Clock. Generated by
FPGA internal oscillator. Frequency
controlled by ConfigRate bitstream
generator option. If CCLK PCB trace is
long or has multiple connections,
terminate this output to maintain signal
integrity. See
Considerations.
Serial Data Output.
Initialization Indicator. Active Low.
Goes Low at start of configuration during
Initialization memory clearing process.
Released at end of memory clearing,
when mode select pins are sampled. In
daisy-chain applications, this signal
requires an external 4.7 kΩ pull-up
resistor to VCCO_2.
CCO
input.
CCLK Design
Description
Design
Pins.
Pins.
Design
www.xilinx.com
Drive at valid logic level
throughout configuration.
M2 = 0, M1 = 0, M0 = 1.
Sampled when INIT_B goes
High.
Must be at the logic levels
shown in
when INIT_B goes High.
FPGA sends SPI Flash memory
read commands and starting
address to the PROM’s serial
data input.
FPGA receives serial data from
PROM’s serial data output.
Connects to the SPI Flash
PROM’s chip-select input. If
HSWAP = 1, connect this signal
to a 4.7 kΩ pull-up resistor to
3.3V.
Drives PROM’s clock input.
Actively drives. Not used in
single-FPGA designs. In a
daisy-chain configuration, this
pin connects to DIN input of the
next FPGA in the chain.
Active during configuration. If
SPI Flash PROM requires > 2
ms to awake after powering on,
hold INIT_B Low until PROM is
ready. If CRC error detected
during configuration, FPGA
drives INIT_B Low.
During Configuration
Table
53. Sampled
DS312-2 (v3.8) August 26, 2009
User I/O
User I/O
User I/O
User I/O
User I/O
Drive CSO_B High after
configuration to disable the
SPI Flash and reclaim the
MOSI, DIN, and CCLK pins.
Optionally, re-use this pin
and MOSI, DIN, and CCLK
to continue communicating
with SPI Flash.
User I/O
User I/O
User I/O. If unused in the
application, drive INIT_B
High.
After Configuration
Product Specification
R