AM50DL128BG70I Spansion Inc., AM50DL128BG70I Datasheet - Page 63
AM50DL128BG70I
Manufacturer Part Number
AM50DL128BG70I
Description
Manufacturer
Spansion Inc.
Datasheet
1.AM50DL128BG70I.pdf
(64 pages)
Specifications of AM50DL128BG70I
Operating Supply Voltage (max)
3.3V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Not Compliant
PHYSICAL DIMENSIONS
FTA073—73-Ball Fine-Pitch Grid Array 8 x 11.6 mm
62
A
CORNER
0.15
(2X)
PIN A1
A2
PACKAGE
SYMBOL
JEDEC
SD/SE
E1
eE
MD
ME
O
eD
A1
A2
D1
A
D
E
n
b
A1
C
73X
B2,B3,B4,B7,B8,B9,C2,C9,C10
H1,H10,J1,J10,K1,K2,K9,K10
D1,D10,E1,E10,F5,F6,G5,G6
M2,M3,M4,M5,M6,M7,M8,M9
MIN.
---
0.25
1.00
0.30
A2,A3,A4,A5,A6,A7,A8,A9
INDEX MARK
11.60 mm x 8.00 mm
0.15
0.08 M
L2,L3,L4,L7,L8,L9
6
10
PACKAGE
11.60 BSC.
FTA 073
b
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC
0.80 BSC
0.40 BSC
M
NOM.
0.35
N/A
12
10
73
---
---
---
C A B
C
MAX.
SIDE VIEW
1.40
---
1.11
TOP VIEW
0.40
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALL
P R E L I M I N A R Y
NOTE
Am50DL128BG
C
A
0.15
(2X)
E
B
C
0.20 C
0.08
eE
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
C
10
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M
L
K
SD
7
J
BOTTOM VIEW
H
G
D1
F
E
D C
B
A
January 8, 2003
SE
CORNER
PIN A1
7
3159\38.14b
E1