HSDL-3201#001 Lite-On Electronics, HSDL-3201#001 Datasheet - Page 15

• Manufacturer Part Number: HSDL-3201#001
• Description: Infrared Transceivers IR Transceiver 115.2Kb/s
• Manufacturer: Lite-On Electronics
• Type: TX/RXr
• Series: -r

Specifications of HSDL-3201#001

• Pulse Width: 1.6/2.45us
• Led Supply Voltage: 2.7 to 6V
• Dimensions: 8x3x2.5
• Peak Wavelength: 875/880nm
• Angle Of Half Sensitivity: 60/30°
• Communication Distance: 30
• Package Type: Ultra Small Profile
• Fall Time: 600/25ns
• Rise Time: 600/20ns
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Mounting: Surface Mount
• Pin Count: 9
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Data Rate: 115.2Kbps
• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 115.2 Kbit/s
• Transmission Distance: 30 cm
• Radiant Intensity: 9 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Maximum Rise Time: 120 ns, 600 ns
• Maximum Fall Time: 80 ns, 600 ns
• Operating Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Package / Case: Ultra Small Profile
• Idle Current, Typ @ 25° C: 100µA
• Link Range, Low Power: 30cm
• Operating Temperature: -25°C ~ 85°C
• Orientation: Side View
• Shutdown: Yes
• Size: 8mm x 3mm x 2.5mm
• Standards: IrPHY 1.2
• Supply Voltage: 2.7 V ~ 3.6 V
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Compliant

Recommended Solder
Paste/Cream Volume for
Castellation Joints
Based on calculation and experi-ment,
the printed solder paste volume
required per castellation pad is 0.22
cubic mm (based on either no-clean
or aqueous solder cream types with
typically 60% to 65% solid content by
volume). Using the recommended
stencil results in this volume of solder
paste.
Pick and Place
Misalignment Tolerance
and Self-Alignment after
Solder Reflow
If the printed solder paste volume is
adequate, the HSDL-3201 will self
align after solder reflow. Units should
be properly reflowed in IR/Hot Air
convection oven using the recom-
mended reflow profile. The direction
of board travel does not matter.
Allowable Misalignment
Direction
X
Y
q
15
Tolerance
See text
0.2 mm
Y
3 degrees
X
Direction Definition
Tolerance for X-axis Alignment of
Castellation
Misalignment of castellation to the
land pad should not exceed 0.2 mm
or about one half the width of the
castellation during placement of the
unit. The castellations will self-align to
the pads during solder reflow.
Tolerance for Rotational (q)
Misalignment
Mounted units should not be rotated
more than 3 degrees with reference
to center X-Y as shown in the direction
definition. Units that are rotated more
than 3 degrees will not self align
after solder reflow. Units with less than
a 3 degree misalign-ment will self-
align after solder reflow.
FIDUCIAL
MINIMUM 1/2 THE LENGTH
OF THE LAND PAD
Y-axis Misalignment of
Castellation
In the Y direction, the HSDL-3201 does
not self align after solder reflow. Avago
recommends that the part be placed
in line with the fiducial mark (mid-
length of land pad.) This will enable
sufficient land length (minimum of
one half of the land pad) to form a
good joint. See the drawing below.
EDGE