HSDL-3220-021 Lite-On Electronics, HSDL-3220-021 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3220-021
• Description: Infrared Transceivers IR Transceiver
• Manufacturer: Lite-On Electronics

Specifications of HSDL-3220-021

• Wavelength: 875 nm, 880 nm
• Continual Data Transmission: 4 Mbit/s
• Transmission Distance: 50 cm
• Radiant Intensity: 45 mW/sr
• Half Intensity Angle Degrees: 30 deg to 60 deg
• Pulse Width: 4 us, 1.6 us
• Maximum Rise Time: 60 ns, 600 ns
• Maximum Fall Time: 60 ns, 600 ns
• Led Supply Voltage: 0 V to 6.5 V
• Maximum Forward Current: 50 mA
• Operating Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Dimensions: 8 mm x 3 mm x 2.5 mm
• Data Rate: 4Mbs (FIR)
• Idle Current, Typ @ 25° C: 1.8 mA
• Link Range, Low Power: 1m
• Operating Temperature: -25°C ~ 70°C
• Orientation: Side View
• Shutdown: *
• Size: 8mm x 3mm x 2.5mm
• Standards: IrPHY 1.4
• Supply Voltage: 2.7 V ~ 3.6 V
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Compliant

Recommended Metal Solder Stencil Aperture
It is recommended that only a 0.152 mm (0.006 inches)
or a 0.127 mm (0.005 inches) thick stencil be used for
solder paste printing. This is to ensure adequate printed
solder paste volume and no shorting. See the table be-
low the drawing for combinations of metal stencil aper-
ture and metal stencil thickness that should be used.
Aperture opening for shield pad is 2.7 mm x 1.25 mm as
per land pattern.
Stencil thickness, Aperture size (mm)
t (mm) length, l
0.152 mm
0.127 mm
Adjacent Land Keepout and Solder Mask Areas
Adjacent land keep-out is the maximum space oc-
cupied by the unit relative to the land pattern. There
should be no other SMD components within this area.
The minimum solder resist strip width required to avoid
solder bridging adjacent pads is 0.2 mm.
Figure 15. Adjacent land keepout and solder mask areas.
12
SOLDER MASK
0.2
2.60 ± 0.05
3.00 ± 0.05
10.1
width, w
0.55 ± 0.05
0.55 ± 0.05
UNITS: mm
Figure 14. Solder stencil aperature.
It is recommended that two fiducial crosses be place at
mid-length of the pads for unit alignment.
Note: Wet/Liquid Photo-Imageable solder resist/mask is
recommended.
l
APERTURES AS PER
LAND DIMENSIONS
3.85
3.0
w
t