HFCT-5962ATG Avago Technologies US Inc., HFCT-5962ATG Datasheet - Page 4

• Manufacturer Part Number: HFCT-5962ATG
• Manufacturer: Avago Technologies US Inc.

Specifications of HFCT-5962ATG

• Optical Fiber Type: TX/RX
• Data Transfer Rate: 155Mbps
• Optical Rise Time: 2ns
• Optical Fall Time: 2ns
• Operating Temperature Classification: Industrial
• Peak Wavelength: 1360/1580nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 3.1V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.5V
• Output Current: 50mA
• Operating Temp Range: -40C to 85C
• Mounting: Snap Fit To Panel
• Pin Count: 20
• Lead Free Status / RoHS Status: Compliant

NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Package
The overall package concept for these devices consists
of the following basic elements; two optical subassem-
blies, two electrical subassemblies and the housing as
illustrated in the block diagram in Figure 3.
The package outline drawing and pin out are shown in
Figures 4 and 5. The details of this package outline and
pin out are compliant with the multisource definition
of the 2 x 10 DIP. The low profile of the Avago Technolo-
gies transceiver design complies with the maximum
height allowed for the LC connector over the entire
length of the package.
The electrical subassemblies consist of high volume
multilayer printed circuit boards on which the IC and
various surface-mounted passive circuit elements are
attached.
The receiver electrical subassembly includes an internal
shield for the electrical and optical subassembly to en-
sure high immunity to external EMI fields.
DATA OUT
DATA OUT
SIGNAL
DATA IN
DATA IN
Tx DISABLE
Figure 3. Block Diagram
4
DETECT
AND CONTROL
LASER DRIVER
T
X
CIRCUIT
GROUND
QUANTIZER IC
R
T
X
X
SUPPLY
SUPPLY
R
X
MONITORING
LASER DIODE
MODULATOR
LASER BIAS
GROUND
The optical subassemblies are each attached to their
respective transmit or receive electrical subassemblies.
These two units are then fitted within the outer housing
of the transceiver that is molded of filled nonconductive
plastic to provide mechanical strength. The housing is
then encased with a metal EMI protective shield. The
case is connected to signal ground and we recommend
soldering the four ground tabs to host card signal
ground.
The PCBs for the two electrical subassemblies both carry
the signal pins that exit from the bottom of the trans-
ceiver. The solder posts are fastened into the molding of
the device and are designed to provide the mechanical
strength required to withstand the loads imposed on
the transceiver by mating with the LC connectored fiber
cables. Although they are not connected electrically to
the transceiver, it is recommended to connect them to
chassis ground.
CASE
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
NOTE
LC
RECEPTACLE