HFCT-5963NG Avago Technologies US Inc., HFCT-5963NG Datasheet - Page 9

• Manufacturer Part Number: HFCT-5963NG
• Manufacturer: Avago Technologies US Inc.

Specifications of HFCT-5963NG

• Optical Fiber Type: TX/RX
• Data Transfer Rate: 155Mbps
• Optical Rise Time: 2ns
• Optical Fall Time: 2ns
• Operating Temperature Classification: Commercial
• Peak Wavelength: 1360/1580nm
• Package Type: DIP With Connector
• Operating Supply Voltage (min): 3.1V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.5V
• Output Current: 50mA
• Operating Temp Range: -5C to 70C
• Mounting: Snap Fit To Panel
• Pin Count: 10
• Lead Free Status / RoHS Status: Compliant

Figure 7. Recommended Board Layout Hole Pattern
Signal Detect
The Signal Detect circuit provides a de-asserted out-
put signal when the optical link is broken (or when the
remote transmitter is OFF). The Signal Detect thresh-
old is set to transition from a high to low state be-
tween the minimum receiver input optical power and
-45 dBm avg. input optical power indicating a defi-
nite optical fault (e.g. unplugged connector for the
receiver or transmitter, broken fiber, or failed far-end
transmitter or data source). The Signal Detect does
not detect receiver data error or error-rate. Data errors
can be determined by signal processing offered by
upstream PHY ICs.
Electromagnetic Interference (EMI)
One of a circuit board designer’s foremost concerns
is the control of electromagnetic emissions from
electronic equipment. Success in controlling gener-
ated Electromagnetic Interference (EMI) enables the
designer to pass a governmental agency’s EMI regula-
tory standard and more importantly, it reduces the
possibility of interference to neighboring equipment.
Avago Technologies has designed the HFCT-5963TL/
TG/NL/NG/ATL/ATG to provide excellent EMI perfor-
9
(0.525)
(0.299)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE
4. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
5. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
13.34
7.59
GROUND CONNECTION IN KEEP-OUT AREAS.
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
2 x Ø 2.29 MAX.
(0.118)
3
(0.09)
(0.055 ±0.004)
2 x Ø 1.4 ±0.1
(0.236)
(0.118)
6
3
(0.28)
7.11
(0.18)
4.57
(0.700)
(0.055 ±0.004)
17.8
2 x Ø 1.4 ±0.1
4 x 1.78
(0.07)
(0.121)
3.08
(0.079)
(0.14)
3.56
2
10.16
(0.4)
(0.378)
9.59
10 x Ø 0.81 ±0.1
(0.032 ±0.004)
2 x Ø 2.29
mance. The EMI performance of a chassis is dependent
on physical design and features which help improve
EMI suppression. Aavago Technologies encourages
using standard RF suppression practices and avoiding
poorly EMI-sealed enclosures.
Avago Technologies’ OC-3 LC transceivers (HFCT-
5963TL/TG/NL/NG/ATL/ATG) have nose shields which
provide a convenient chassis connection to the nose
of the transceiver. This nose shield improves system
EMI performance by effectively closing off the LC aper-
ture. Localized shielding is also improved by tying the
four metal housing package grounding tabs to signal
ground on the PCB. Though not obvious by inspec-
tion, the nose shield and metal housing are electrically
separated for customers who do not wish to directly
tie chassis and signal grounds together. The recom-
mended transceiver position, PCB layout and panel
opening for these devices are the same, making them
mechanically drop-in compatible. Figure 8 shows the
recommended positioning of the transceivers with re-
spect to the PCB and faceplate.
(0.09)
(0.079)
2
(0.055 ±0.004)
4 x Ø 1.4 ±0.1