PC725V0NSZXF Sharp Electronics, PC725V0NSZXF Datasheet
![](/photos/31/35/313543/6pin_dip_sml.jpg)
PC725V0NSZXF
Specifications of PC725V0NSZXF
Related parts for PC725V0NSZXF
PC725V0NSZXF Summary of contents
Page 1
PC725V0NSZX Series ■ Description PC725V0NSZX Series contains an IRED optically coupled to a phototransistor packaged pin DIP, available in SMT gullw- ing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 300V, CTR is ...
Page 2
Internal Connection Diagram ■ Outline Dimensions 1. Through-Hole [ex. PC725V0NSZX] ±0.3 1.2 ±0.2 0.6 SHARP mark "S" Anode mark Date code ±0.5 7.12 ±0.1 ...
Page 3
Wide SMT Gullwing Lead-Form [ex. PC725V0NUZX] ±0.2 0.6 ±0.3 1.2 SHARP mark "S" Date code Anode mark ±0.5 7.62 7.12 Epoxy resin ±0.25 2.54 ±0.25 0.75 10.16 12.0 6. Wide SMT Gullwing Lead-Form ...
Page 4
Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
Page 5
Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Collector-base voltage V CBO Emitter-base voltage V EBO Collector current I C −I ...
Page 6
Model Line-up Lead Form Through-Hole Sleeve Package 50pcs/sleeve −−−−−− VDE0884 Approved Model No. PC725V0NSZX PC725V0YSZX Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. SMT Gullwing −−−−−− −−−−−− Approved PC725V0NIZX PC725V0YIZX PC725V0NIPX PC725V0YIPX ...
Page 7
Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 350 300 250 200 150 100 50 0 − Ambient ...
Page 8
Fig.7 Current Transfer Ratio vs. Forward Current 8 000 = =25˚ 000 6 000 =∞ 000 =1MΩ 000 =500kΩ 000 2 000 1 000 0 0.1 ...
Page 9
Fig.13 Test Circuit for Response Time V CC Input R D Output R L Output Input V CE Please refer to the conditions in Fig.12 Fig.15 Test Circuit for Frequency Response R D Please refer to the conditions in Fig.14 ...
Page 10
Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
Page 11
Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
Page 12
Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
Page 13
Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. ...
Page 14
Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ...
Page 15
Wide SMT Gullwing Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.2 0.4 Reel structure ...
Page 16
Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...