USB97CFDC2-MV-01P Standard Microsystems (SMSC), USB97CFDC2-MV-01P Datasheet - Page 24

• Manufacturer Part Number: USB97CFDC2-MV-01P
• Manufacturer: Standard Microsystems (SMSC)

Specifications of USB97CFDC2-MV-01P

• Lead Free Status / RoHS Status: Supplier Unconfirmed

11 MECHANICAL OUTLINE
Note 1: Controlling Unit: millimeter
Note 2: Minimum space between protrusion and an adjacent lead is .007 mm.
Note 3: Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm
Note 5: Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC DS – USB97CFDC2-01
D/2
E/2
ccc
A1
A2
E1
R1
R2
L1
D1
W
D
H
A
E
L
e
θ
13.80
11.80
13.80
11.80
0.05
1.35
6.90
6.90
0.09
0.45
0.13
0.08
0.08
MIN
0
~
~
~
o
NOMINAL
0.40 Basic
14.00
12.00
14.00
12.00
1.40
7.00
0.60
1.00
0.16
3.5
7.00
~
~
~
~
~
~
o
FIGURE 9 - 100 PIN TQFP PACKAGE
DATASHEET
14.20
12.20
14.20
12.20
MAX
1.60
0.15
1.45
7.10
7.10
0.20
0.75
0.23
0.20
0.08
7
~
~
o
Page 24
Overall Package Height
Standoff
Body Thickness
X Span
1
X body Size
Y Span
1
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
/
/
2
2
X Span Measure from Centerline
Y Span Measure from Centerline
REMARK
Rev. 02-27-07