STPCE1HDBI STMicroelectronics, STPCE1HDBI Datasheet - Page 56
STPCE1HDBI
Manufacturer Part Number
STPCE1HDBI
Description
Manufacturer
STMicroelectronics
Datasheet
1.STPCE1HDBI.pdf
(87 pages)
Specifications of STPCE1HDBI
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Processing Unit
Microprocessor
Operating Supply Voltage (min)
2.45/3V
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
2.7/3.6V
Package Type
BGA
Screening Level
Industrial
Pin Count
388
Mounting
Surface Mount
Rad Hardened
No
Lead Free Status / RoHS Status
Supplier Unconfirmed
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MECHANICAL DATA
5.2. 388-PIN PACKAGE THERMAL DATA
The 388-pin PBGA package has a Power
Dissipation Capability of 4.5W. This increases to
6W when used with a Heatsink.
56/87
Board
Signal layers
Ambient
Case
Junction
Board
Ambient
Figure 5-5. Thermal Dissipation Without Heatsink
Rca
Rjc
Rjb
Rba
Figure 5-4. 388-Pin PBGA structure
Board
Release 1.3 - January 29, 2002
8.5
Rja = 13 °C/W
6
Junction
Ambient
Thermal balls
6
125
Case
The structure in shown in
Thermal dissipation options are illustrated in
Figure 5-5
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
Airflow = 0
Board temperature taken at the centrecentre ba
and
Figure
Power & Ground layers
5-6.
Figure
5-4.
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