UPD3747D Renesas Electronics America, UPD3747D Datasheet - Page 20

no-image

UPD3747D

Manufacturer Part Number
UPD3747D
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of UPD3747D

Lead Free Status / RoHS Status
Supplier Unconfirmed

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD3747D
Manufacturer:
INTEL
Quantity:
6 219
Part Number:
UPD3747D
Manufacturer:
EC
Quantity:
1 000
Part Number:
UPD3747D
Manufacturer:
EC
Quantity:
20 000
Part Number:
UPD3747D-A
Manufacturer:
ATMEL
Quantity:
4 600
Part Number:
UPD3747D-A
Manufacturer:
NEC
Quantity:
1 000
Part Number:
UPD3747D-A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
18
1
2
3
4
MOUNTING OF THE PACKAGE
to come off internally. Particular care should be taken when mounting the package on the circuit board. Don't
have any object come in contact with glass cap. You should not reform the lead frame. We recommended to
use a IC-inserter when you assemble to PCB.
GLASS CAP
Care should be taken to avoid mechanical or thermal shock because the glass cap is easily to damage. For
dirt stuck through electricity ionized air is recommended.
OPERATE AND STORAGE ENVIRONMENTS
to mechanical shocks. Exposure to high temperatures or humidity will affect the characteristics. So avoid
storage or usage in such conditions.
devices are transported from a low-temperature environment to a high-temperature environment. Avoid such
rapid temperature changes.
ELECTROSTATIC BREAKDOWN
detected. Before handling be sure to take the following protective measures.
The application of an excessive load to the package may cause the package to warp or break, or cause chips
Also, be care that the any of the following can cause the package to crack or dust to be generated.
Don’t either touch glass cap surface by hand or have any object come in contact with glass cap surface.
Operate in clean environments. CCD image sensors are precise optical equipment that should not be subject
Keep in a case to protect from dust and dirt. Dew condensation may occur on CCD image sensors when the
For more details, refer to our document "Review of Quality and Reliability Handbook" (C12769E)
CCD image sensor is protected against static electricity, but destruction due to static electricity is sometimes
1. Applying heat to the external leads for an extended period of time with soldering iron.
2. Applying repetitive bending stress to the external leads.
3. Rapid cooling or heating
1. Ground the tools such as soldering iron, radio cutting pliers of or pincer.
2. Install a conductive mat or on the floor or working table to prevent the generation of static electricity.
3. Either handle bare handed or use non-chargeable gloves, clothes or material.
4. Ionized air is recommended for discharge when handling CCD image sensor.
5. For the shipment of mounted substrates, use box treated for prevention of static charges.
6. Anyone who is handling CCD image sensors, mounting them on PCBs or testing or inspecting PCBs on
which CCD image sensors have been mounted must wear anti-static bands such as wrist straps and ankle
straps which are grounded via a series resistance connection of about 1 MΩ.
NOTES ON HANDLING THE PACKAGES
Data Sheet S14892EJ4V0DS
μ
PD3747

Related parts for UPD3747D