MC100EPT23D ON Semiconductor, MC100EPT23D Datasheet - Page 2

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MC100EPT23D

Manufacturer Part Number
MC100EPT23D
Description
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC100EPT23D

Logic Family
ECL
Logical Function
Translator
Technology
ECL
High Level Output Current
-3mA
Low Level Output Current
24mA
Operating Supply Voltage (typ)
3.3V
Package Type
SOIC N
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Abs. Propagation Delay Time
2.4ns
Mounting
Surface Mount
Pin Count
8
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Not Compliant

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Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 3. MAXIMUM RATINGS
Symbol
V
V
I
T
T
q
q
q
q
q
T
q
out
A
stg
JA
JC
JA
JC
JA
sol
JC
CC
I
Figure 1. Logic Diagram and 8−Lead Pinout
D1
D0
D1
D0
Power Supply
Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
1
2
3
4
1. For additional information, see Application Note AND8003/D.
Table 2. ATTRIBUTES
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
LVPECL
(Top View)
Parameter
LVTTL
Characteristics
Pb−Free
8
7
6
5
V
Q0
Q1
GND
Pb
CC
http://onsemi.com
GND = 0 V
GND = 0 V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 2)
Oxygen Index: 28 to 34
Charged Device Model
Condition 1
Human Body Model
2
Machine Model
Table 1. PIN DESCRIPTION
** Pins will default to V
Q0, Q1
D0**, D1**
D0**, D1**
V
GND
EP
CC
Pin
V
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
DFN8
I
 V
Condition 2
CC
LVTTL/LVCMOS Outputs
Differential LVPECL/LVDS/CML Inputs
Positive Supply
Ground
(DFN8 only) Thermal exposed pad must be
connected to a sufficient thermal conduit.
Electrically connect to the most negative
supply (GND) or leave unconnected, floating
open.
UL 94 V−0 @ 0.125 in
CC
91 Devices
/2 when left open.
> 1500 V
> 100 V
Level 1
> 2 kV
50 kW
50 kW
Value
Function
−65 to +150
−40 to +85
41 to 44
41 to 44
35 to 40
Rating
100
190
130
185
140
129
265
265
3.8
3.8
50
84
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
mA
°C
°C
°C
V
V

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