BAP50-03 NXP Semiconductors, BAP50-03 Datasheet - Page 3

• Manufacturer Part Number: BAP50-03
• Description: General purpose PIN diode in a SOD323 small plastic SMD package
• Manufacturer: NXP Semiconductors

Specifications of BAP50-03

• Configuration: Single
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 500mW
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Package Type: SOD-323
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 40@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 5@10mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
BAP50-03_4
Product data sheet
Fig 1.
Fig 3.
(fF)
(dB)
C
L
ins
(1) I
(2) I
(3) I
d
500
400
300
200
100
0
0
1
2
3
4
5
0.5
0
f = 1 MHz; T
Diode capacitance as a function of reverse
voltage; typical values
T
Diode inserted in series with a 50
biased via the analyzer Tee network.
Insertion loss of the diode as a function of
frequency; typical values
F
F
F
amb
= 10 mA
= 1 mA
= 0.5 mA
= 25 C.
4
1
j
= 25 C.
1.5
8
12
2
(1)
(2)
(3)
2.5
16
stripline circuit and
V
f (GHz)
mgs323
R
mgs319
(V)
Rev. 04 — 11 September 2009
20
3
Fig 2.
Fig 4.
(dB)
ISL
( )
r
10
10
D
10
15
20
25
10
10
0
5
1
3
2
0.5
f = 100 MHz; T
Diode forward resistance as a function of
forward current; typical values
T
Diode zero biased and inserted in series with a 50
stripline circuit.
Isolation of the diode as a function of
frequency; typical values
2
amb
= 25 C.
1
10
j
= 25 C.
1
1.5
General purpose PIN diode
2
1
BAP50-03
I
© NXP B.V. 2009. All rights reserved.
2.5
F
(mA)
f (GHz)
mgs316
mgs317
10
3
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