BAP50-03 NXP Semiconductors, BAP50-03 Datasheet - Page 7

• Manufacturer Part Number: BAP50-03
• Description: General purpose PIN diode in a SOD323 small plastic SMD package
• Manufacturer: NXP Semiconductors

Specifications of BAP50-03

• Configuration: Single
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 500mW
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Package Type: SOD-323
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 40@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 5@10mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 5
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
Contact information. . . . . . . . . . . . . . . . . . . . . . 6
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
General purpose PIN diode
Date of release: 11 September 2009
Document identifier: BAP50-03_4
BAP50-03
All rights reserved.