SR1530HCLR Intel (CPU), SR1530HCLR Datasheet - Page 18

• Manufacturer Part Number: SR1530HCLR
• Manufacturer: Intel (CPU)

Specifications of SR1530HCLR

• Lead Free Status / RoHS Status: Not Compliant

Functional Architecture
3.1.2.1
When two processors are installed, both must be of identical revision, core voltage, and
bus/core speed. When only one processor is installed, it must be in the socket labeled CPU1.
The other socket must be empty.
The board provides up to 90A max, 70A TDC per processor. Processors with higher current
requirements are not supported.
3.1.2.2
The server board complies with Intel’s common enabling kit (CEK) processor mounting and heat
sink retention solution. The server board ships with a CEK spring snapped onto the underside of
the server board, beneath each processor socket. The heat sink attaches to the CEK, over the
top of the processor and the thermal interface material (TIM). See the figure below for the
stacking order of the chassis, CEK spring, server board, TIM, and heat sink.
The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.
8
Processor Population Rules
Common Enabling Kit (CEK) Design Support
Low-Voltage Quad-
Core Intel
Xeon
Dual-Core Intel
processor 5300
Intel
5100 series
processor
®
series
®
processor
Xeon
®
Xeon
®
®
®
Table 1. Processor Support Matrix
Intel order number: D64569-006
System Bus Speed
1066 MHz
1066 MHz
1333 MHz
1333 MHz
1333 MHz
1333 MHz
1066 MHz
1066 MHz
1333 MHz
1333 MHz
533 MHz
667 MHz
800 Mhz
Core Frequency
1.60 GHz
1.86 GHz
2.00 GHz
2.33 GHz
2.66 GHz
3.00 GHz
1.60 GHz
1.86 GHz
2.00 GHz
2.33 GHz
All
All
All
Intel
®
Server Board S5000VCL TPS
Support
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Revision 2.2