PC355NTJ000F Sharp Electronics, PC355NTJ000F Datasheet

PC355NTJ000F

Manufacturer Part Number
PC355NTJ000F
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of PC355NTJ000F

Input Type
DC
Output Type
DC
Output Device
Darlington
Number Of Elements
1
Reverse Breakdown Voltage
6V
Forward Voltage
1.4V
Forward Current
50mA
Collector-emitter Voltage
35V
Package Type
Mini Flat
Collector Current (dc) (max)
80mA
Isolation Voltage
3750Vrms
Power Dissipation
170mW
Collector-emitter Saturation Voltage
1V
Fall Time
250000ns
Rise Time
300000ns
Pin Count
4
Mounting
Surface Mount
Operating Temp Range
-30C to 100C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant

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Part Number
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Quantity
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Part Number:
PC355NTJ000F
Quantity:
6 217
■ Description
■ Features
PC355NJ0000F
Series
coupled to a phototransistor.
1. 4-pin Mini-flat package
2. Double transfer mold package (Ideal for Flow Solder-
3. Darlington phototransistor output (CTR : MIN. 600%
4. High isolation voltage between input and output
5. Lead-free and RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
PC355NJ0000F Series contains an IRED optically
It is packaged in a 4-pin Mini-flat.
Input-output isolation voltage(rms) is 3.75kV.
CTR is MIN 600% at input current of 1.0mA.
ing)
at I
(V
iso(rms)
F
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
= 1mA, V
: 3.75kV)
CE
=2V)
1
■ Agency approvals/Compliance
■ Applications
Mini-flat Package,
Darlington Phototransistor Output
Photocoupler
1. Recognized by UL1577 (Double protection isolation),
2. Package resin : UL flammability grade (94V-0)
1. Hybrid substrates that require high density mounting
2. Programmable controllers
file No. E64380 (as model No. PC355)
PC355NJ0000F Series
Sheet No.: D2-A00802EN
© SHARP Corporation
Date Jun. 30. 2005

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PC355NTJ000F Summary of contents

Page 1

PC355NJ0000F Series ■ Description PC355NJ0000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat. Input-output isolation voltage(rms) is 3.75kV. CTR is MIN 600% at input current of 1.0mA. ■ Features 1. 4-pin Mini-flat ...

Page 2

Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. Date code SHARP mark "S" Anode mark 1 2 ±0.1 0.4 Epoxy resin Product mass : approx. 0.1g Plating material : SnCu ...

Page 3

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 4

Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...

Page 5

... Model Line-up Taping Package 3 000 pcs/reel 750 pcs/reel Model No. PC355NJ0000F PC355NTJ000F Please contact a local SHARP sales representative to inquire about production status. PC355NJ0000F Series 5 Sheet No.: D2-A00802EN ...

Page 6

Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 − Ambient temperature T ...

Page 7

Fig.7 Current Transfer Ratio vs. Forward Current 5 000 4 000 3 000 2 000 1 000 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − ...

Page 8

Fig.13 Test Circuit for Response Time V CC Input R L Input R Output Output Please refer to the conditions in Fig.12 Remarks : Please be aware that all data in the graph are just ...

Page 9

Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...

Page 10

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 11

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...

Page 12

Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...

Page 13

Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ±0.1 ±0.05 7.4 ...

Page 14

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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