MC9S08QE128CLH Freescale, MC9S08QE128CLH Datasheet - Page 2

• Manufacturer Part Number: MC9S08QE128CLH
• Manufacturer: Freescale

Specifications of MC9S08QE128CLH

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 50.33MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 8KB
• # I/os (max): 54
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 22-chx12-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 128KB
• Lead Free Status / RoHS Status: Compliant

1
2
3
2
MC9S08QE128 Series Comparison. . . . . . . . . . . . . . . . . . . . .4
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Parameter Classification . . . . . . . . . . . . . . . . . . . . . . . .12
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . .12
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .13
ESD Protection and Latch-Up Immunity . . . . . . . . . . . .14
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Supply Current Characteristics . . . . . . . . . . . . . . . . . . .18
External Oscillator (XOSC) Characteristics . . . . . . . . .21
Internal Clock Source (ICS) Characteristics . . . . . . . . .22
MC9S08QE128 Series Data Sheet, Rev. 7
Table of Contents
4
5
6
7
3.11 Analog Comparator (ACMP) Electricals . . . . . . . . . . . 30
3.12 ADC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.13 Flash Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.1
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
5.1
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
3.10.1 Control Timing . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.10.2 TPM Module Timing . . . . . . . . . . . . . . . . . . . . . 26
3.10.3 SPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Device Numbering System . . . . . . . . . . . . . . . . . . . . . 34
Mechanical Drawings. . . . . . . . . . . . . . . . . . . . . . . . . . 35
Freescale Semiconductor