LFEC3E-3FN256C LATTICE SEMICONDUCTOR, LFEC3E-3FN256C Datasheet - Page 69
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LFEC3E-3FN256C
Manufacturer Part Number
LFEC3E-3FN256C
Description
FPGA LatticeEC Family 3100 Cells 340MHz 130nm (CMOS) Technology 1.2V 256-Pin FBGA
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet
1.LFEC3E-5TN144C.pdf
(163 pages)
Specifications of LFEC3E-3FN256C
Package
256FBGA
Family Name
LatticeEC
Device Logic Units
3100
Maximum Internal Frequency
340 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
160
Ram Bits
56320
In System Programmability
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFEC3E-3FN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
PICs and DDR Data (DQ) Pins Associated with the DDR Strobe (DQS) Pin
P[Edge] [n-4]
P[Edge] [n-3]
P[Edge] [n-2]
P[Edge] [n-1]
P[Edge] [n]
P[Edge] [n+1]
P[Edge] [n+2]
P[Edge] [n+3]
Notes:
1. “n” is a Row/Column PIC number
2. The DDR interface is designed for memories that support one DQS strobe per eight bits of
3. PIC numbering definitions are provided in the “Signal Names” column of the Signal Descrip-
data. In some packages, all the potential DDR data (DQ) pins may not be available.
tions table.
PICs Associated
with DQS Strobe
PIO Within PIC
4-3
A
B
A
B
A
B
A
B
A
B
A
B
A
B
A
B
LatticeECP/EC Family Data Sheet
DDR Strobe (DQS) and
Data (DQ) Pins
[Edge]DQSn
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
Pinout Information
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