LFXP2-8E-6FTN256C Lattice, LFXP2-8E-6FTN256C Datasheet - Page 82

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LFXP2-8E-6FTN256C

Manufacturer Part Number
LFXP2-8E-6FTN256C
Description
IC DSP 8KLUTS 201I/O 256FTBGA
Manufacturer
Lattice
Datasheet

Specifications of LFXP2-8E-6FTN256C

Number Of Logic Elements/cells
*
Number Of Labs/clbs
*
Total Ram Bits
226304
Number Of I /o
201
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
*
Operating Temperature
0°C ~ 85°C
Package / Case
*
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
220-1109

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFXP2-8E-6FTN256C
Manufacturer:
LATTICE
Quantity:
101
Part Number:
LFXP2-8E-6FTN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Pin Information Summary (Cont.)
Lattice Semiconductor
Logic Signal Connections
Package pinout information can be found under “Data Sheets” on the LatticeXP2 product page of the Lattice web-
site a www.latticesemi.com/products/fpga/xp2 and in the Lattice ispLEVER software.
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Lattice
package specific thermal values.
For Further Information
• TN1139,
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from 
PCI capable I/Os 
Bonding Out per
Bank
1. Minimum requirement to implement a fully functional 8-bit wide DDR bus. Available DDR interface consists of at least 12 I/Os (1 DQS + 1 DQSB + 8 DQs + 1 DM
www.latticesemi.com/products/designsoftware
+ Bank VREF1).
Pin Type
Power Estimation and Management for LatticeXP2 Devices
Bank0
Bank1
Bank2
Bank3
Bank4
Bank5
Bank6
Bank7
csBGA
132
18
14
4
0
0
8
0
0
TQFP
144
20
18
6
0
0
8
0
0
XP2-5
PQFP
208
20
18
18
20
0
0
0
0
ftBGA
256
26
18
18
24
0
0
0
0
csBGA
132
18
14
4
0
0
8
0
0
TQFP
144
20
18
6
0
0
8
0
0
XP2-8
4-5
PQFP
208
20
18
18
20
0
0
0
0
Thermal Management
ftBGA
256
28
22
26
24
0
0
0
0
PQFP
208
20
18
18
20
0
0
0
0
XP2-17
ftBGA
256
28
22
26
24
0
0
0
0
LatticeXP2 Family Data Sheet
fpBGA
484
52
36
36
52
0
0
0
0
ftBGA
document to find the device/
256
28
22
26
24
0
0
0
0
Pinout Information
XP2-30
fpBGA
484
52
36
38
53
0
0
0
0
fpBGA
672
70
54
54
70
0
0
0
0
fpBGA
484
52
36
38
53
0
0
0
0
XP2-40
fpBGA
672
70
70
70
70
0
0
0
0

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