SI5330B-A00204-GM Silicon Laboratories Inc, SI5330B-A00204-GM Datasheet - Page 17

• Manufacturer Part Number: SI5330B-A00204-GM
• Description: IC BUFFER LVDS DIFF 4OUT 24-QFN
• Manufacturer: Silicon Laboratories Inc
• Type: Fanout Buffer (Distribution), Translatorr

Specifications of SI5330B-A00204-GM

• Number Of Circuits: 1
• Ratio - Input:output: 1:4
• Differential - Input:output: Yes/Yes
• Input: CML, CMOS, HCSL, HSTL, LVDS, LVPECL, LVTTL, SSTL
• Output: LVDS
• Frequency - Max: 710MHz
• Voltage - Supply: 1.71 V ~ 3.63 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-QFN
• Frequency-max: 710MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 336-1550-5

8. Recommended PCB Layout
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. Connect the center ground pad to a ground plane with no less than five vias to a ground plane that is no more than
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
9. A 2x2 array of 1.0 mm square openings on 1.25 mm pitch should be used for the center ground pad.
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
20 mils below it. Via drill size should be no smaller than 10 mils. A longer distance to the ground plane is allowed if
more vias are used to keep the inductance from increasing.
to be 60 µm minimum, all the way around the pad.
paste release.
Dimension
P1
P2
X1
Y1
C1
C2
E
Table 12. PCB Land Pattern
2.50
2.50
0.20
0.75
Min
Rev. 0.35
3.90
3.90
0.50
Nom
2.55
2.55
0.25
0.80
Max
2.60
2.60
0.30
0.85
Si5330
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