MAX9315EUP+ Maxim Integrated Products, MAX9315EUP+ Datasheet - Page 2
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MAX9315EUP+
Manufacturer Part Number
MAX9315EUP+
Description
IC DRIVER DIFF 1:5 20-TSSOP
Manufacturer
Maxim Integrated Products
Type
Fanout Buffer (Distribution), Multiplexer , Datar
Datasheet
1.MAX9315EUP.pdf
(11 pages)
Specifications of MAX9315EUP+
Number Of Circuits
1
Ratio - Input:output
2:5
Differential - Input:output
Yes/Yes
Input
HSTL, LVECL, LVPECL
Output
LVECL, LVPECL
Frequency - Max
1.5GHz
Voltage - Supply
2.25 V ~ 3.8 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Frequency-max
1.5GHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ABSOLUTE MAXIMUM RATINGS
V
Inputs (CLK_, CLK_, SEL, EN)
CLK_ to CLK_ ....................................................................±3.0V
Continuous Output Current .................................................50mA
Surge Output Current........................................................100mA
V
Continuous Power Dissipation (T
Junction-to-Ambient Thermal Resistance in Still Air
DC ELECTRICAL CHARACTERISTICS
(V
values are at V
1:5 Differential LVPECL/LVECL/HSTL
Clock and Data Driver
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
CC
BB
Single-Layer PC Board
SINGLE-ENDED INPUTS (SEL, EN)
Input High Voltage
Input Low Voltage
Input Current
DIFFERENTIAL INPUTS (CLK_, CLK_)
Single-Ended Input
High Voltage
(Note 4)
Single-Ended Input
Low Voltage
(Note 4)
High Voltage of
Differential Input
Low Voltage of
Differential Input
CC
to V
Single-Layer PC Board
20-Pin TSSOP (derate 7.69mW/°C above +70°C) .......615mW
Multilayer PC Board
20-Pin TSSOP (derate 10.9mW/°C above +70°C) .......879mW
20-Pin TSSOP .........................................................+130°C/W
_______________________________________________________________________________________
Sink/Source Current ...............................................±0.65mA
PARAMETER
- V
- V
EE
EE
EE
...........................................(V
...............................................................................4.1V
= 2.375V to 3.8V, outputs loaded with 50Ω ±1% to V
CC
- V
EE
SYMBOL
= +3.3V, V
V
V
V
V
V
V
I
IHD
ILD
IN
IH
IH
IL
IL
A
= +70°C)
IHD
V
V
CLK_, Figure 1
V
CLK_, Figure 1
IH(MAX)
BB
BB
EE
CONDITIONS
= V
connected to
connected to
- 0.3V) to (V
CC
, V
- 1V, V
IL(MIN)
ILD
CC
= V
+ 0.3V)
V
V
1.225
V
1.225
-500
MIN
V
V
V
EE
1.2
CC
CC
CC
EE
EE
EE
+
-
-
- 1.5V.) (Notes 1, 2, 3)
CC
-40°C
TYP
- 2V, SEL = high or low,
Junction-to-Ambient Thermal Resistance with 500LFPM
Junction-to-Case Thermal Resistance
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ESD Protection
Soldering Temperature (10s) ...........................................+300°C
Multilayer PC Board
Airflow Single-Layer PC Board
20-Pin TSSOP ............................................................+20°C/W
Human Body Model (Inputs and Outputs) .......................≥2kV
20-Pin TSSOP ...........................................................+91°C/W
20-Pin TSSOP ..........................................................+9.6°C/W
V
1.625
V
1.625
V
MAX
V
V
V
500
0.1
CC
CC
CC
CC
CC
CC
-
-
-
V
V
1.225
V
1.225
-500
MIN
V
V
V
EE
1.2
CC
CC
EE
EE
EE
+
-
-
+25°C
TYP
EN = low, unless otherwise noted. Typical
V
1.625
V
1.625
V
MAX
V
V
V
500
0.1
CC
CC
CC
CC
CC
CC
-
-
-
V
V
1.225
V
1.225
-500
MIN
V
V
V
EE
1.2
CC
CC
EE
EE
EE
+
-
-
+85°C
TYP
V
1.625
V
1.625
V
MAX
V
V
V
500
0.1
CC
CC
CC
CC
CC
CC
-
-
-
UNITS
µA
V
V
V
V
V
V