MC100EP210SMNG ON Semiconductor, MC100EP210SMNG Datasheet - Page 7

• Manufacturer Part Number: MC100EP210SMNG
• Description: IC CLOCK DRIVER LVDS DUAL 32-QFN
• Manufacturer: ON Semiconductor
• Series: 100EPr
• Type: Fanout Buffer (Distribution)r

Specifications of MC100EP210SMNG

• Number Of Circuits: 2
• Ratio - Input:output: 1:5
• Differential - Input:output: Yes/Yes
• Input: LVDS, LVPECL
• Output: LVDS
• Frequency - Max: 1GHz
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TFQFN Exposed Pad
• Frequency-max: 1GHz
• Number Of Outputs: 20
• Operating Supply Voltage (max): 2.625V
• Operating Temp Range: -40C to 85C
• Propagation Delay Time: 0.675ns
• Operating Supply Voltage (min): 2.375V
• Mounting: Surface Mount
• Pin Count: 32
• Operating Supply Voltage (typ): 2.5V
• Package Type: QFN EP
• Input Frequency: >1000MHz
• Operating Temperature Classification: Industrial
• Clock Ic Type: Clock Driver
• Frequency: 1GHz
• No. Of Outputs: 5
• Ic Output Type: LVDS
• Supply Current: 150mA
• Supply Voltage Range: 2.375V To 2.625V
• Digital Ic Case Style: QFN
• No. Of Pins: 32
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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32 X
2 X
2 X
LOCATION
0.15 C
0.10 C
0.08 C
PIN ONE
0.15 C
32 X
L
32 X
0.10
0.05 C
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
8
1
C
É É É É
BOTTOM VIEW
32
9
A
SIDE VIEW
TOP VIEW
B
D2
D
16
25
A1
17
(A3)
24
e
E
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
EXPOSED PAD
E2
PACKAGE DIMENSIONS
A
B
32 X
K
QFN32 5*5*1 0.5 P
http://onsemi.com
MC100EP210S
A
CASE 488AM−01
C
ISSUE O
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEATING
PLANE
7
0.63
32 X
0.28
SOLDERING FOOTPRINT*
32 X
3.20
5.30
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
A
b
D
E
K
L
e
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
0.800
0.000
0.180
2.950
2.950
0.200
0.300
MIN
MILLIMETERS
0.500 BSC
0.200 REF
5.00 BSC
5.00 BSC
NOM
0.900
0.025
0.250
3.100
3.100
0.400
0.50 PITCH
28 X
−−−
3.20
1.000
0.050
0.300
3.250
3.250
0.500
MAX
−−−
MC100EP210S/D
5.30