SY89826LHI Micrel Inc, SY89826LHI Datasheet - Page 3

• Manufacturer Part Number: SY89826LHI
• Description: IC BUFFER LVDS 3.3V 1:22 64-TQFP
• Manufacturer: Micrel Inc
• Series: Precision Edge®r
• Type: Fanout Buffer (Distribution), Multiplexer , Translatorr

Specifications of SY89826LHI

• Number Of Circuits: 1
• Ratio - Input:output: 2:22
• Differential - Input:output: Yes/Yes
• Input: LVDS, LVPECL
• Output: LVDS
• Frequency - Max: 1GHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad, 64-eTQFP, 64-HTQFP, 64-VQFP
• Frequency-max: 1GHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Micrel, Inc.
Absolute Maximum Ratings
Power Supply Voltage (V
Input Voltage (V
Output Current (I
Lead Temperature (T
Storage Temperature (T
ESD Rating, Note 3 .................................................... >1kV
Note 1.
Note 2.
Note 3.
Power Supply
Symbol
V
I
I
Note 4.
LVDS Input
Symbol
V
V
I
R
M9999-011907
[e-mail] or [phone]
CCI
CCO
IL
CCI
IN
ID
IN
DC ELECTRICAL CHARACTERISTICS
, V
CCO
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional
operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE
MAXIMUM RATlNG conditions for extended periods may affect device reliability.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Devices are ESD sensitive. Handling precautions recommended.
V
connected on the die.
CCI
: V
and V
Parameter
V
I
I
Parameter
Input Voltage Range
Differential Input Swing
Input LOW Current
LVDS Differential Input Resistance
(LVDS_CLK to /LVDS_CLK)
CC
CC
: T
CC
CC
IN
OUT
CCO
Core
Output
Core, V
) ........................................... –0.5 to V
A
= 3.3V 10%, T
= –40 C to +85 C
) ............................................... 10mA
must be connected together on the PCB such that they remain at the same potential. V
LEAD
S
CC
CCI
) ........................... –65 to +150 C
, Soldering, 20sec.) .......... 260 C
Output
, V
CCO
A
= –40 C to +85 C
) .............. –0.5 to +4.0V
(Note 1)
Condition
Note 4
Max. V
No Load, Max. V
Condition
CC
CCI
3
Operating Ratings
Supply Voltage (V
Ambient Temperature (T
Package Thermal Resistance
CC
TQFP
Exposed pad soldered to GND
Exposed pad NOT soldered to GND (not recommened)
TQFP
Still-Air(multi-layer PCB) .................................. 23 C/W
–200lfpm (multi-layer PCB) ............................. 18 C/W
–500lfpm (multi-layer PCB) ............................. 15 C/W
Still-Air(multi-layer PCB) .................................. 44 C/W
–200lfpm (multi-layer PCB) ............................. 36 C/W
–500lfpm (multi-layer PCB) ............................. 30 C/W
JA
JC
)
) ......................................................... 4.4 C/W
CC
to GND) ..................... +3.0V to +3.6V
A
(Note 2)
) ......................... –40 C to +85 C
CCI
–1.25
Min
Min
100
3.0
and V
80
0
CCO
Typ
Typ
175
100
3.3
46
are not internally
Precision Edge
Max
Max
260
120
3.6
2.4
70
SY89826L
Units
Units
mA
mA
mV
mA
V
V
®