09 47 474 7206 HARTING, 09 47 474 7206 Datasheet - Page 121

• Manufacturer Part Number: 09 47 474 7206
• Description: Ha-Vis Smart Patch Cable CAT.6 Yel. 5m
• Manufacturer: HARTING

Specifications of 09 47 474 7206

• Rohs Compliant: Yes

* Also known as Pin-in-Paste or Through Hole Reflow (THR)
The
tion has revolutionised the assembly of elec-
tronic components. For the past 15 years, most
components have been secured directly to the pcb
surface by means of Surface Mount Technology
(SMT). By dispensing with drilled holes on the pcb,
a space saving of up to 70 percent is achieved.
Today, typical components such as ICs, resistors,
capacitors, inductors, and connectors with straight
terminal pins are almost exclusively fitted using
SMD (Surface Mount Device) technology in mass
production. In contrast, angled SMD connectors at the
edge of the board have not been successful because
of tolerance problems (co-planarity) and stresses
during mating.
D-Sub SMC connector
“Pin in Hole Intrusive Reflow*”
In this process, the connector is inserted into plated
through holes in a comparable way to conventional
component mounting. All other components can be
assembled on the pcb surface.
The components are positioned using pick-and-place
machines. These automatic assembly machines differ
according to whether the components are small, light-
weight or bulky. Connectors, compared to ICs, are
considered bulky (odd form). They are more difficult
to grip, due to their comparatively heavy weight and
larger size. But machines for odd form components,
provide the higher insertion power, necessary to fit
the components into pcb holes, which are filled with
solder paste. Generally modern SMC production lines
continuing
Bellows for SMC
trend
towards
miniaturisa-
are equipped with both types of machine. Therefore
the "Pin in Hole Intrusive Reflow" process entails no
extra investment costs for the user.
D-Sub in pick and place machine equipped with vacuum nozzle
Conventional assembly process:
1. Application of solder paste
2. Positioning the components
3. Positioning odd form components
4. Reflow soldering
5. Pressing in or partially dip soldering the
6. Quality inspection
“Pin in Hole Intrusive Reflow” assembly:
1. Application of solder paste
2. Positioning the components
3. Positioning odd form components
4. Reflow soldering
5. Pressing in or partially dip soldering the
6. Quality inspection
General information
connector at the board edge
connector at the board edge
121