09 47 474 7206 HARTING, 09 47 474 7206 Datasheet - Page 144

• Manufacturer Part Number: 09 47 474 7206
• Description: Ha-Vis Smart Patch Cable CAT.6 Yel. 5m
• Manufacturer: HARTING

Specifications of 09 47 474 7206

• Rohs Compliant: Yes

144
Skew within differential pairs
Technical characteristics for Plug Connectors
Design according
Number of contacts
Contact spacing
Clearance and creepage
distance between contacts 0.1 mm min.
Working current of
power contacts
as defined
in AMC.0 spec., tested with HARTING
MicroTCA™ backplane connector
Test voltage
Working voltage typically
Initial contact resistance 25 mW max.
Initial insulation resistance 100 MW min.
Nominal differential
impedance
Propagation delay
Temperature range
Durability as per
AMC.0 specification
Termination technique
Pick-and-place-weight
Mating force
Withdrawal force
The mating and withdrawal force is highly depending
on the mating half connector, but typically only 50 %
to 70 % of the mating force of a PCB card edge.
Max. crosstalk @ 25 ps risetime
Adjacent
Basic-to-extended (diagonal)
Basic-to-extended (opposite)
Multiline (five multi-aggressor
differential pairs)
Long contact side:
Short contact side:
Long contact side:
Short contact side:
during reflow soldering 220 °C for 2 minutes
PICMG MicroTCA.0 R1.0
PICMG AMC.0 R2.0
(RoHS compliance)
170
0.75 mm
~ 2.4 A @ 70 °C
max. 30 °C temp. rise
(PICMG requirement min. 1.52 A)
80 V
3.3 V; 5.0 V; 12.0 V
100 Ω ± 10 %
-55 °C … +105 °C
270 °C max. short-term
200 mating cycles in total
Solder termination (Pin in
Hole Intrusive Reflow)
< 7 g
100 N max., typically 40 - 70 N
(depending on backplane
connector)
(depending on backplane
connector)
65 N max., typically 30 - 50 N
r.m.s.
Bottom route
0.5 %
0.2 %
0.7 %
2.1 % max.
152 ps / 147 ps
121 ps / 129 ps
5 ps
8 ps
Materials
Moulded parts
Contacts
Contact surface
Packaging
Stencil recommendation
Each termination requires a solder paste volume of
0.5 mm³. Since the stencil can only provide fractions of
this volume (0.29 mm³ at 0.15 mm stencil thickness),
the remaining solder paste must be pressed into the
plated through hole. For a nominal AMC card (1.6 mm
PCB thickness, 0.55 mm plated hole diameter) the
paste must penetrate the hole by 0.9 mm.
Plated through hole recommendations
A
B
C Pad size
Plated hole-Ø
Drill hole-Ø
Liquid Crystal Polymer
(LCP), UL 94-V0
Copper alloy
Au over Ni
Tray packaging (other
packaging on request)
0.55
0.65
0.95 mm
±0.05
±0.01
mm
mm