1-1473005-4 TE Connectivity, 1-1473005-4 Datasheet - Page 3

• Manufacturer Part Number: 1-1473005-4
• Description: SEMI-HARD TRAY DDR2 SODIMM SOCKET 200P 5
• Manufacturer: TE Connectivity

Specifications of 1-1473005-4

• Socket Style: SO DIMM
• Dram Type: Double Data Rate (DDR)
• Pcb Mount Style: Surface Mount
• Module Orientation: Right Angle
• Profile: Standard
• Keying: Standard
• Dram Voltage: 1.8 V
• Solder Tail Contact Plating: Gold Flash
• Socket Type: Memory Card
• Number Of Positions: 200
• Row-to-row Spacing (mm [in]): 6.20 [0.244]
• Centerline (mm [in]): 0.60 [0.024]
• Number Of Rows: Dual
• Ejector Type: Locking
• Ejector Location: Both Ends
• Number Of Keys: 1
• Latch Material: Stainless Steel
• Latch Plating: Tin
• Boss: Without
• Mount Type: Printed Circuit Board
• Contact Plating, Mating Area, Material: Gold Flash
• Contact Base Material: Copper Alloy
• Housing Material: High Temperature Thermoplastic
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Stack Height (mm [in]): 5.20 [0.205]
• Insertion Style: Cam-In
• Center Key (mm [in]): None
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Application Type: DDR SDRAM
• Packaging Method: Semi-Hard Tray Assembly
• Packaging Quantity: 20

3.5.6
3.5.7
Para.
3.5.8
3.5.9
3.5.10
3.5.11
Para.
3.5.12
3.5.13
3.5.14
Rev. F
Physical Shock
P.C.Board Mating Force
Test Items
Durability
(Repeated
Mate/Unmating)
Solder ability
Resistance to Reflow
Soldering Heat
Thermal Shock
Test Items
Humidity-Temperature
Cycling
Salt Spray
Industrial Gas (SO2)
No electrical discontinuity
greater than 0.1 sec. shall
occur.
∆R=20 m Æ Max. (Final)
200 Pos. : 59.8N (6.1 kgf) Max.
Requirements
∆R=20 m Æ Max. (Final)
Wet Solder Coverage :
95 % Min.
No physical damage shall
occur
∆R=20 m Æ Max. (Final)
∆ 4
∆ 4
∆ 4
4 G S W K T G O G P V U
+ P U W N C V K Q P T G U K U V C P E G
Environmental Requirements
Product Specification
O Æ / C Z
O Æ / C Z
O Æ / C Z
/ Æ / K P H K P C N
( K P C N
( K P C N
( K P C N
Accelerated Velocity : 490 m/s
Waveform
Duration : 11 m sec.
Number of Drops: 3 drops each to normal
and reversed directions of X, Y and Z
axes, totally 18 drops.
AMP Spec. 109-5208
Condition A
Operation Speed : 100 mm/min.
Measure the force required to mate
connectors.(In this test, the force required
to turn PCB before it engages on lacking,
is excluded.)
AMP Spec. 109-5206
Procedures
Repeated insertion and extraction of P.C.B
to and from the connector with the turns to
lock it and then unlock it for 25 cycles.
Solder Temperature : 245 r 5 ° C
Immersion Duration : 5 r 0.5 seconds
Flux : Alpha 100
AMP Spec. 109-5203
Test connector on P.C.Board
Mated connector
9 55°C / 30 min.,
85° C / 30 min.
Making this a cycle, repeat 5 cycles.
AMP Spec. 109-5103 Condition A
Procedures
Mated connector, 25:* 65°C,
90:* 95 % R. H. 5 cycles
Cold shock 9 10° C performed
AMP Spec. 109-5106
Subject mated connectors to 5 % salt
concentration for 24 hours :
AMP Spec. 109-5101
Mated connector
SO2 Gas : 10 ppm, 95 % R. H.
25° C, 24 hours
AMP Spec. 109-5107
Pre-Heat150:* 180 ‘ :90 r 30sec.
Heat 230 ‘ Min.
Heat Peak260 ‘ Max. See Fig.4-2
OR
Apply to JEDEC standard
(J-STD-020C)
: Half sine
Condition B
:30 r 10sec.
Condition A
Condition A
2
108-5701
(50 G)
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