PCF8563TS/4,118 NXP Semiconductors, PCF8563TS/4,118 Datasheet - Page 38
![IC REAL TIME CLK/CALENDAR 8TSSOP](/photos/5/43/54394/8-tssop_sot505-2_pkg_sml.jpg)
PCF8563TS/4,118
Manufacturer Part Number
PCF8563TS/4,118
Description
IC REAL TIME CLK/CALENDAR 8TSSOP
Manufacturer
NXP Semiconductors
Type
Clock/Calendarr
Datasheet
1.PCF8563TF4118.pdf
(45 pages)
Specifications of PCF8563TS/4,118
Package / Case
8-TSSOP
Time Format
HH:MM:SS (24 hr)
Date Format
YY-MM-DD-dd
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Function
Clock/Calendar/Alarm/Timer Interrupt
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Rtc Bus Interface
Serial (2-Wire, I2C)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-3615 - DEMO BOARD I2C
Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4517-2
935279522118
PCF8563TS-T
PCF8563TS-T
935279522118
PCF8563TS-T
PCF8563TS-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PCF8563TS/4,118
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
16. Handling information
17. Soldering of SMD packages
PCF8563
Product data sheet
17.1 Introduction to soldering
17.2 Wave and reflow soldering
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
•
•
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 18 November 2010
Real-time clock/calendar
PCF8563
© NXP B.V. 2010. All rights reserved.
38 of 45