M48T08-150PC1 STMicroelectronics, M48T08-150PC1 Datasheet - Page 19

• Manufacturer Part Number: M48T08-150PC1
• Description: IC TIMEKPR NVRAM 64KBIT 5V 28-DI
• Manufacturer: STMicroelectronics
• Series: Timekeeper®r
• Type: Clock/Calendar/NVSRAMr

Specifications of M48T08-150PC1

• Memory Size: 64K (8K x 8)
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: Parallel
• Voltage - Supply: 4.75 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 28-DIP Module (600 mil), 28-EDIP
• Function: Clock/Calendar/NV Timekeeping RAM/Battery Backup
• Rtc Memory Size: 8192 Byte
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.75 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: Through Hole
• Rtc Bus Interface: Parallel
• Capacitance, Input: 10 pF
• Capacitance, Output: 10 pF
• Current, Input, Leakage: ±1 μA
• Current, Operating: 80 mA
• Current, Output, Leakage: ±1
• Data Retention: 10 yrs.
• Density: 64K
• Memory Type: Non-Volatile SRAM
• Organization: 8K×8
• Package Type: PCDIP28
• Power Dissipation: 1 W
• Temperature, Operating: 0 to +70 °C
• Time, Access: 150 ns
• Time, Fall: ≤5 ns
• Time, Rise: ≤5 ns
• Voltage, Input, High: 5.05 to 5.8 V
• Voltage, Input, Low: 0.8 V
• Voltage, Output, High: 2.4 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 4.75 to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-2829-5

M48T08, M48T08Y, M48T18
4
Caution:
Caution:
Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 6.
1. For DIP package, soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds. In order to
2. For DIP packaged devices, ultrasound vibrations should not be used for post-solder cleaning to avoid
3. For SO package, lead-free (Pb-free) lead finish: reflow at peak temperature of 260 °C (the time above
Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
Do NOT wave solder SOIC to avoid damaging SNAPHAT
T
SLD
protect the lithium battery, preheat temperatures must be limited such that the battery temperature does
not exceed +85 °C. Furthermore, the devices shall not be exposed to IR reflow.
damaging the crystal.
255 °C must not exceed 30 seconds).
Symbol
T
V
V
P
T
STG
I
(1)(2)(3)
CC
O
IO
A
D
Absolute maximum ratings
Ambient operating temperature
Storage temperature (V
Lead solder temperature for 10 seconds
Input or output voltages
Supply voltage
Output current
Power dissipation
Doc ID 2411 Rev 10
Parameter
CC
off, oscillator off)
®
sockets.
–40 to 85
–0.3 to 7
–0.3 to 7
0 to 70
Value
260
20
1
Maximum ratings
Unit
mA
°C
°C
°C
W
V
V
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