X1226V8 Intersil, X1226V8 Datasheet - Page 23

• Manufacturer Part Number: X1226V8
• Description: IC RTC/CALENDAR/4K EE 8-TSSOP
• Manufacturer: Intersil
• Type: Clock/Calendar/EEPROMr

Specifications of X1226V8

• Memory Size: 4K (512 x 8)
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Referring to Figure 16, Vtrip applies to the “Internal
Vcc” node which powers the entire device. This means
that if Vcc is powered down and the battery voltage at
Vback is higher than the Vtrip voltage, then the entire
chip will be running from the battery. If Vback falls to
lower than Vtrip, then the chip shuts down and all out-
puts are disabled except for the oscillator and time-
keeping circuitry. The fact that the chip can be
powered from Vback is not necessarily an issue since
standby current for the RTC devices is <2µA for this
mode (called “main timekeeping current” in the data
sheet). Only when the serial interface is active is there
an increase in supply current, and with Vcc powered
down, the serial interface will most likely be inactive.
One way to prevent operation in battery backup mode
above the Vtrip level is to add a diode drop (silicon
diode preferred) to the battery to insure it is below
Vtrip. This will also provide reverse leakage protection
which may be needed to get safety agency approval.
One mode that should always be avoided is the oper-
ation of the RTC device with Vback greater than both
Vcc and Vtrip (Condition 2d in Table 8). This will
cause the battery to drain quickly as serial bus com-
munication and non-volatile writes will require higher
supplier current.
23
X1226
PERFORMANCE DATA
I
BACK
1.4
1.2
1.0
0.8
0.6
0.4
0.2
Performance
0
-40
Multi-Lot Process Variation Data
I
BACK
Temperature °C
25
vs. Temperature
60
3.3V
1.8V
85
May 8, 2006
FN8098.3