AD9640BCPZ-80 Analog Devices Inc, AD9640BCPZ-80 Datasheet - Page 14

• Manufacturer Part Number: AD9640BCPZ-80
• Description: IC ADC 14BIT 80MSPS 1.8V 64LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9640BCPZ-80

• Data Interface: Serial, SPI™
• Design Resources: Interfacing ADL5534 to AD9640 High Speed ADC (CN0049)
• Number Of Bits: 14
• Sampling Rate (per Second): 80M
• Number Of Converters: 2
• Power Dissipation (max): 492mW
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-LFCSP
• Resolution (bits): 14bit
• Sampling Rate: 150MSPS
• Input Channel Type: Differential
• Supply Voltage Range - Analog: 1.7V To 1.9V
• Supply Current: 233mA
• Digital Ic Case Style: CSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9640-150EBZ - BOARD EVALUATION AD9640 150MSPS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD9640
ABSOLUTE MAXIMUM RATINGS
Table 9.
Parameter
ELECTRICAL
ENVIRONMENTAL
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AVDD, DVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
VIN+A/VIN+B, VIN−A/VIN−B to AGND
CLK+, CLK− to AGND
SYNC to AGND
VREF to AGND
SENSE to AGND
CML to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to DRGND
SDIO/DCS to DRGND
SMI SDO/OEB
SMI SCLK/PDWN
SMI SDFS
D0A/D0B through D13A/D13B to
FD0A/FD0B through FD3A/FD3B to
DCOA/DCOB to DRGND
Operating Temperature Range
Maximum Junction Temperature
Storage Temperature Range
DRGND
DRGND
(Ambient)
Under Bias
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−3.9 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +150°C
Rev. B | Page 14 of 52
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints and maximizes
the thermal capability of the package.
Table 10. Thermal Resistance
Package
Type
64-lead LFCSP
9 mm × 9 mm
1
2
3
4
Typical θ
plane. As shown, airflow improves heat dissipation, which
reduces θ
package leads from metal traces, through holes, ground, and
power planes, reduces the θ
ESD CAUTION
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-Std 883, Method 1012.1.
Per JEDEC JESD51-8 (still air).
JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
JA
JA
. In addition, metal in direct contact with the
is specified for a 4-layer PCB with a solid ground
Airflow
Velocity
(m/s)
0
1.0
2.0
JA
.
θ
18.8
16.5
15.8
JA
1, 2
θ
0.6
JC
1, 3
θ
6.0
JB
1, 4
Unit
°C/W
°C/W
°C/W