MAX1042BETX+T Maxim Integrated Products, MAX1042BETX+T Datasheet - Page 2

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MAX1042BETX+T

Manufacturer Part Number
MAX1042BETX+T
Description
IC ADC/DAC 10BIT W/FIFO 36TQFN
Manufacturer
Maxim Integrated Products
Type
ADC, DACr
Datasheet

Specifications of MAX1042BETX+T

Resolution (bits)
10 b
Sampling Rate (per Second)
225k
Data Interface
DSP, MICROWIRE™, QSPI™, Serial, SPI™
Voltage Supply Source
Analog and Digital
Voltage - Supply
4.75 V ~ 5.25 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
36-TQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
10-Bit, Multichannel ADCs/DACs with FIFO,
Temperature Sensing, and GPIO Ports
ABSOLUTE MAXIMUM RATINGS
AV
DGND to AGND.....................................................-0.3V to +0.3V
DV
Digital Inputs to DGND.............................................-0.3V to +6V
Digital Outputs to DGND .........................-0.3V to (DV
Analog Inputs, Analog Outputs and REF_
Maximum Current into Any Pin (except AGND, DGND, AV
ELECTRICAL CHARACTERISTICS
(AV
otherwise noted. Typical values are at AV
Note: If the package power dissipation is not exceeded, one output at a time can be shorted to AV
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
DC ACCURACY (Note 1)
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Gain Temperature Coefficient
Channel-to-Channel Offset
DYNAMIC SPECIFICATIONS (10kHz sine-wave input, V
Signal-to-Noise Plus Distortion
Total Harmonic Distortion
(Up to the Fifth Harmonic)
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Linear Bandwidth
Full-Power Bandwidth
CONVERSION RATE (Note 3)
Power-Up Time
to AGND...............................................-0.3V to (AV
DV
DD
DD
DD
_______________________________________________________________________________________
DD
to AGND .........................................................-0.3V to +6V
to AV
= DV
indefinitely.
, and OUT_) ...........................................................50mA
PARAMETER
DD
DD
.......................................................-3.0V to +0.3V
= 4.75V to 5.25V, external reference V
SYMBOL
SINAD
SFDR
DNL
THD
IMD
INL
t
PU
DD
= DV
(Note 2)
f
SINAD > 70dB
-3dB point
External reference
Internal reference (Note 4)
IN1
DD
= 9.9kHz, f
DD
DD
= 5V, T
REF
+ 0.3V)
+ 0.3V)
DD
= 4.096V, f
IN
,
A
CONDITIONS
= 4.096V
= +25°C. Outputs are unloaded, unless otherwise noted.)
IN2
ADC
= 10.2kHz
CLK
Maximum Current into OUT_.............................................100mA
Continuous Power Dissipation (T
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
P-P,
36-Pin Thin QFN (6mm x 6mm)
(derate 26.3mW/°C above +70°C) ..........................2105.3mW
= 3.6MHz (50% duty cycle), T
225ksps, f
CLK
= 3.6MHz)
MIN
10
A
±0.025
A
±0.25
TYP
±0.5
±0.5
±1.4
±0.1
= +70°C)
100
218
-70
DD
0.8
= -40°C to +85°C, unless
61
66
72
1
, DV
DD
MAX
±1.0
±2.0
±2.0
, AGND, or DGND
±1
C onver si on
ppm/°C
UNITS
cycl es
cl ock
MHz
LSB
Bits
LSB
LSB
LSB
LSB
dBc
dBc
dBc
kHz
dB
µs

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