TDA8754HL/17/C1,51 NXP Semiconductors, TDA8754HL/17/C1,51 Datasheet - Page 54
![IC TRPL 8BIT VIDEO ADC LQFP144](/photos/6/65/66532/144-lqfp_sot486-1_pkg_sml.jpg)
TDA8754HL/17/C1,51
Manufacturer Part Number
TDA8754HL/17/C1,51
Description
IC TRPL 8BIT VIDEO ADC LQFP144
Manufacturer
NXP Semiconductors
Type
Video ADCr
Datasheet
1.TDA8754HL14C155.pdf
(57 pages)
Specifications of TDA8754HL/17/C1,51
Package / Case
144-LQFP
Resolution (bits)
8 b
Sampling Rate (per Second)
170M
Data Interface
Serial
Voltage Supply Source
Analog and Digital
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-10°C ~ 70°C
Mounting Type
Surface Mount
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935272703518
TDA8754HL17BE-T
TDA8754HL17BE-T
TDA8754HL17BE-T
TDA8754HL17BE-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA8754HL/17/C1,51
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Philips Semiconductors
9397 750 14984
Product data sheet
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These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 06 — 16 June 2005
Triple 8-bit video ADC up to 270 Msps
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
TDA8754
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