MCP4021T-103E/MS Microchip Technology, MCP4021T-103E/MS Datasheet - Page 57
![IC DGTL POT 10K 1CH 8MSOP](/photos/6/59/65932/mfg_150_c04-111_ms_8-msop_sml.jpg)
MCP4021T-103E/MS
Manufacturer Part Number
MCP4021T-103E/MS
Description
IC DGTL POT 10K 1CH 8MSOP
Manufacturer
Microchip Technology
Specifications of MCP4021T-103E/MS
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Taps
64
Resistance (ohms)
10K
Number Of Circuits
1
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Non-Volatile
Interface
Up/Down
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Resistance In Ohms
10K
Number Of Pots
Single
Taps Per Pot
64
Resistance
10 KOhms
Wiper Memory
Non Volatile
Digital Interface
Serial (2-Wire)
Operating Supply Voltage
3.3 V, 5 V
Supply Current
45 uA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.7 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP4XXXDM-DB - BOARD DAUGHTER DIGIPOT MCP4XXXMCP402XEV - BOARD EVAL FOR MCP402X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP4021T-103E/MS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
© 2006 Microchip Technology Inc.
Note:
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
3. Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
shall not exceed 0.15 mm per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1
2
b
D
e
Dimension Limits
E1
A2
Microchip Technology Drawing No. C04–111, Sept. 8, 2006
E
Units
c
A2
A1
E1
L1
N
D
e
A
E
L
ϕ
b
c
MIN
0.75
0.00
0.40
0.08
0.22
—
0°
MILLIMETERS
L1
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
—
—
—
—
—
8
MCP4021/2/3/4
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
DS21945E-page 57
ϕ