ISL22326UFR16Z-TK Intersil, ISL22326UFR16Z-TK Datasheet - Page 2
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ISL22326UFR16Z-TK
Manufacturer Part Number
ISL22326UFR16Z-TK
Description
IC POT DGTL 128TP LN LP 16-QFN
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.ISL22326UFR16Z.pdf
(15 pages)
Specifications of ISL22326UFR16Z-TK
Taps
128
Resistance (ohms)
50K
Number Of Circuits
2
Temperature Coefficient
80 ppm/°C Typical
Memory Type
Non-Volatile
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-VQFN Exposed Pad, 16-HVQFN, 16-SQFN, 16-DHVQFN
Resistance In Ohms
50K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Block Diagram
Pin Descriptions
*Note: PCB thermal land for QFN EPAD should be connected to GND plane or left floating. For more information refer to
http://www.intersil.com/data/tb/TB389.pdf
TSSOP PIN
NUMBER
10
12
13
14
11
1
2
3
4
5
6
7
8
9
SHDN
SDA
SCL
NUMBER
QFN PIN
A0
A1
A2
EPAD*
4, 9
15
16
10
11
12
13
14
1
2
3
5
6
7
8
2
INTERFACE
I
2
C
PIN NAME
SHDN
RW0
GND
RW1
SDA
V
RH0
SCL
RH1
RL0
RL1
NC
A2
A0
A1
CC
AND STATUS
INTERFACE,
REGISTERS
POWER-UP
CONTROL
VOLATILE
LOGIC
ISL22326
NON-
Power supply pin
Shutdown active low input
“High” terminal of DCP0
“Low” terminal of DCP0
“Wiper” terminal of DCP0
Device address input for the I
Open drain I
Open drain Serial data I/O for the I
Device ground pin
“Wiper” terminal of DCP1
“Low” terminal of DCP1
“High” terminal of DCP1
Device address input for the I
Device address input for the I
No connection
Exposed Die Pad internally connected to GND
GND
V
CC
2
C interface clock input
WR1
WR0
2
2
2
C interface
C interface
C interface
DESCRIPTION
2
C interface
RW1
RH1
RH0
RW0
RL1
RL0
September 8, 2009
FN6176.2