2-1926733-5 TE Connectivity, 2-1926733-5 Datasheet - Page 4
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2-1926733-5
Manufacturer Part Number
2-1926733-5
Description
RECEPTACLE CONNECTOR 25 SIGNAL + 10 POWER POSITIONS
Manufacturer
TE Connectivity
Specifications of 2-1926733-5
Rohs Compliant
YES
Pcb Mount Alignment
Without
Pcb Mount Retention
With
Pcb Mounting Orientation
Right Angle
Make First / Break Last
Yes
Product Line
MINIPAK HDL
Ul File Number
E28476
Termination Method To Pc Board
Through Hole - Press Fit
Sealed
No
Number Of Power Positions
10
Operating Voltage Reference
AC
Operating Voltage (vac)
250
Hot Pluggable
No
Tail Length (mm [in])
3.3 [0.13]
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
8.00 [0.315]
Number Of Signal Positions
25
Number Of Positions
35
Pcb Mount Retention Type
Screw Mount
Selectively Loaded
Yes
Centerline (mm [in])
2.00 [0.079]
Centerline, Power Contacts (mm [in])
2.75 [0.108]
Underplate Material Thickness (µm [?in])
1.27 [50.000]
Length (x-axis) (mm [in])
51.71 [2.040]
Width (z-axis) (mm [in])
36.58 [1.440]
Number Of Rows
1
Mating Retention
Without
Tail Plating Material
Bright Tin-Lead
Contact Type
Socket
Contact Base Material
Copper
Contact Plating, Mating Area, Material
Gold or Palladium Nickel or Performance Based
Contact Plating, Mating Area, Thickness (µm [?in])
0.762 [30]
Tail Plating, Thickness (µm [?in])
0.5 [20]
Underplate Material
Nickel
Contact Design
Single Beam
Connector Style
Receptacle
Mating Alignment
With
Housing Material
Crystal Polymer
Ul Flammability Rating
UL 94V-0
Housing Color
Black
Mating Alignment Type
Passive Guide
Connector Contact Configuration (no. Of Pos./type)
25/Signal, 10/AC Power
Custom Configurable
No
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Agency/standard
UL, CSA
Ul Rating
Recognized
Ul Voltage Rating (vac)
250
Csa Certified
Yes
Operating Temperature (°c [°f])
-40 – +125 [-40 – +257]
Pcb Thickness, Recommended (mm [in])
1.40 [0.055]
Applies To
Printed Circuit Board
Board-to-board Configuration
Co-Planar
Contact Transmits (typical Application)
Signal (Data)/ Power
Application Use
Board-to-Board
Pick And Place Cover
Without
Packaging Method
Tray
Lead Free Status / Rohs Status
Details
Tem perature rise vs current, power
contacts.
Random vibration.
Mechanical shock.
Durability.
Mating force.
Unm ating force.
Com pliant pin insertion.
Com pliant pin retention.
Rev B
Test Description
50 C m axim um tem perature rise.
No discontinuities of 1 m icrosecond
or longer duration.
See Note.
No discontinuities of 1 m icrosecond
or longer duration.
See Note.
See Note.
3 N m axim um for power contact.
Average m ating force for signal
contacts shall be less than 1.65 N
per contact.
0.5 N m inim um per power contact.
0.15 N m inim um per signal contact.
44.5 N m axim um per pin.
10 N m inim um per pin.
Figure 3 (continued)
MECHANICAL
Requirem ent
EIA-364-70, Method 1.
Stabilize at a single current level
until 3 readings at 5 m inute intervals
are within 1 C. Test with single
energized contact and with 2, 4, 8,
12 and 24 adjacent power contacts
energized.
Record data over a range 20 to
50 C tem perature rise.
Docum ent 30 C tem perature rise
current.
EIA-364-28, Test Condition VII,
Condition E.
Subject m ated specim ens to 4.90
G's rm s between 20 to 500 Hz.
Fifteen m inutes in each of 3
m utually perpendicular planes.
EIA-364-27, Condition A.
Subject m ated specim ens to 50 G's
half-sine shock pulses of 11
m illiseconds duration. Three shocks
in each direction applied along 3
m utually perpendicular planes, 18
total shocks.
EIA-364-9.
Mate and unm ate specim ens for
250 cycles at a m axim um rate of
500 cycles per hour.
EIA-364-13.
Measure force necessary to m ate
specim ens at a m axim um rate of
12.7 m m per m inute.
EIA-364-13.
Measure force necessary to unm ate
specim ens at a m axim um rate of
12.7 m m per m inute.
Tyco Electronics 109-41.
Measure force necessary to
correctly apply a specim en to a
PCB at a m axim um rate of 12.7 m m
per m inute.
Tyco Electronics 109-30-1.
Measure force necessary to rem ove
a correctly applied specim en from
its PCB at a m axim um rate of 12.7
m m per m inute.
Procedure
108-2325
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