LTC2600IGN Linear Technology, LTC2600IGN Datasheet - Page 18

• Manufacturer Part Number: LTC2600IGN
• Description: IC DAC R-R 16-BIT OCTAL 16-SSOP
• Manufacturer: Linear Technology

Specifications of LTC2600IGN

• Settling Time: 10µs
• Number Of Bits: 16
• Data Interface: Serial
• Number Of Converters: 8
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 20mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

LTC2600/LTC2610/LTC2620
PACKAGE DESCRIPTION
18
4.50 0.05
3.10 0.05
1.50 REF
5.00 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
2.65 0.05
0.50 BSC
PIN 1
TOP MARK
(NOTE 6)
0.25 0.05
3.65 0.05
4.10 0.05
5.50 0.05
4.00 0.10
(2 SIDES)
2.50 REF
(Reference LTC DWG # 05-08-1711 Rev B)
20-Lead Plastic QFN (4mm × 5mm)
UFD Package
0.70 0.05
0.75 0.05
PACKAGE OUTLINE
0.200 REF
0.00 – 0.05
2.50 REF
R = 0.05 TYP
R = 0.115
TYP
BOTTOM VIEW—EXPOSED PAD
3.65 0.10
2.65 0.10
1.50 REF
19
20
0.50 BSC
0.25 0.05
PIN 1 NOTCH
R = 0.20 OR
C = 0.35
(UFD20) QFN 0506 REV B
1
2
0.40 0.10
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