HMMC-1015 Avago Technologies US Inc., HMMC-1015 Datasheet - Page 4

• Manufacturer Part Number: HMMC-1015
• Manufacturer: Avago Technologies US Inc.

Specifications of HMMC-1015

• Operating Temperature (max): 125C
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Compliant

4
610
233
Figure 2. HMMC-1015 Bonding Pad Locations.
Figure 3. HMMC-1015 Assembly Diagram.
0
4 Wire Bonds using 0.7 mil dia.
0
Notes:
1. All dimensions in microns and shown to center of bond pad.
2. DC
3. RF input and output bonding pads are 60 x 70 microns.
4. Chip thickness: 127 ± 15 µm.
(length NOT important)
Gold Bond Wire
in
, V
RF
1
IN
, DC
out
, and V
DC
2
IN
bonding pads are 75 x 75 microns.
476
TC721R
584
V
1
nom. gap
2.0 mil
DC
OUT
887
994
V
2
RF
OUT
1410
1470
233