HI8586CRM Holt Integrated Circuits, HI8586CRM Datasheet - Page 8
HI8586CRM
Manufacturer Part Number
HI8586CRM
Description
Manufacturer
Holt Integrated Circuits
Datasheet
1.HI8586CRM.pdf
(9 pages)
Specifications of HI8586CRM
Operating Temperature Classification
Military
Operating Temperature (max)
125C
Rad Hardened
No
Lead Free Status / Rohs Status
Not Compliant
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
8-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
8-PIN PLASTIC SMALL OUTLINE (SOIC) - NB
(Narrow Body)
.236 ± .008
(5.99 ± .21)
.236 ± .008
(5.99 ± .21)
(1.27)
.194 ± .004
(4.92 ± .09)
.050
(1.27)
.194 ± .004
(4.92 ± .09)
Top View
.050
.0165 ± .003
(.419 ± .089)
HI-8585 / HI-8586 PACKAGE DIMENSIONS
P
BSC
IN
.0165 ± .003
(.419 ± .089)
P
HOLT INTEGRATED CIRCUITS
BSC
IN
1
1
.154 ± .004
(3.90 ± .09)
0° to 8°
.154 ± .004
(3.90 ± .09)
8
0° to 8°
S
(.838 ± .432)
.033 ± .017
EE
.0085 ± .0015
(.216 ± .038)
D
ETAIL
(.838 ± .432)
.033 ± .017
A
(1.397 ± .127)
D
.055 ± .005
ETAIL
Bottom View
(1.397 ± .127)
A
.055 ± .005
Detail A
See Detail A
.0025 ± .002
(.064 ± .038)
.0085 ± .0015
inches (millimeters)
inches (millimeters)
Package Type: 8HNE
Package Type: 8HN
(.216 ± .038)
(2.54 ± .25)
.100 ± .01
(3.56 ± .26)
.140 ± .01
(.1753 ± .074)
.0069 ± .003
Connect to any ground or
Electrically isolated metal
power plane for optimum
heat sink on bottom of
thermal dissipation
package