HI-1573PSI Holt Integrated Circuits, HI-1573PSI Datasheet
HI-1573PSI
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HI-1573PSI Summary of contents
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... CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic "0" (HI-1573) or logic 1 (HI-1574). To minimize the package size for this function, the ...
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... The Each set of receiver outputs can also be independently BUSA forced to the bus idle state (logic "0” on HI-1573 or logic “1” on HI-1574) by setting RXENA or RXENB low. MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2.5 ratio TXA B / are ei- isolation transformer and two 55 ohm isolation resistors between the transformer and the bus ...
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... Logic TXA/B TXINHA/B RECEIVER RXA/B Receive Logic RXA/B Comparator RXENA/B TXA/B TXA/B BUSA/B - BUSA/B Vin (Line to Line RXA/B (HI-1573) RXA/B (HI-1573) RXA/B (HI-1574) RXA/B (HI-1574) HI-1573, HI-1574 BUSA/B BUSA/B Input Filter Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN HOLT INTEGRATED CIRCUITS 3 ...
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... Supply Voltage -0 +3.6 V VDD....................................... 3.3V... ±5% 10 Vp-p Temperature Range +1.0 A Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C 1.0 W 7mW/°C NOTE: 275°C for 10 sec. ratings or outside recommended operating conditions may cause permanent damage to the 175°C device. These are stress ratings only. Operation at the limits is not recommended. -65° ...
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... OUT TEST CONDITIONS From input zero crossing to RXA/B or RXA/B Spacing between RXA/B and RXA/B pulses From RXENA/B rising or falling edge to RXA/B or RXA/B TXA/B, TXA/B to BUSA/B, BUSA/B 35 ohm load 35 ohm load Inhibited output Active output 1:2.5 BUSA/B BUSA/B Isolation Transformer 2.5 Isolation ...
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... Zo) Figure 3. Transformer Coupled Test Circuits HEAT SINK - ESOIC & CHIP-SCALE PACKAGE Both the HI-1573PSI/T/M and HI-1574PSI/T/M use a 20- pin thermally enhanced SOIC package. The HI- 1573PCI/T/M and HI-1574PCI/T/M use a plastic chip- scale package (QFN). These packages include a metal heat sink located on the bottom surface of the device. ...
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... Matte Tin (Pb-free RoHS compliant) TEMPERATURE BURN RANGE FLOW -40°C TO +85°C I -55°C TO +125°C T -55°C TO +125°C M PACKAGE DESCRIPTION 44 PIN PLASTIC CHIP-SCALE PACKAGE QFN (44PCS) 20 PIN PLASTIC ESOIC, Thermally Enhanced Wide SOIC w/Heat Sink (20HWE) RXENA = 0 RXENB = 0 RXA RXA RXB RXB ...
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... DS1573 L 09/26/08 Clarification of transmitter and receiver functions in Description, clarification of available temperature ranges, and corrected a dimension in Recommended Transformers table. M 04/13/09 Add ‘M’ Flow option to chip-scale package (QFN). Clarify nomenclature of chip-scale package as QFN. N 07/24/09 Correct typographical errors in package dimensions. O 10/13/09 Clarified status of RXA/B and high (logic “ ...
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... TYP. (1.270 TYP.) .085 ±.009 (2.159 ± .229) .100 BSC (2.54) .017 ±.002 (.432 ±.051) HOLT INTEGRATED CIRCUITS 9 inches (millimeters) Package Type: 20HWE .290 typ (7.37) Bottom typ View Electrically isolated heat sink pad on bottom of package ...
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... PLASTIC CHIP-SCALE PACKAGE (QFN) .276 BSC (7.00) .276 Top View BSC (7.00) .039 max (1.00) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) PACKAGE DIMENSIONS .203 ± .006 (5.15 ± .15) Electrically isolated heat sink ...