hi-1573 Holt Integrated Circuits, Inc., hi-1573 Datasheet

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hi-1573

Manufacturer Part Number
hi-1573
Description
3.3v Monolithic Dual Transceivers
Manufacturer
Holt Integrated Circuits, Inc.
Datasheet

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hi-1573CDI
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DESCRIPTION
The HI-1573 and HI-1574 are low power CMOS dual
transceivers designed to meet the requirements of the
MIL-STD-1553 specification.
The transmitter section of each bus takes complementary
CMOS / TTL digital input data and converts it to bi-phase
Manchester encoded 1553 signals suitable for driving the
bus isolation transformer. Separate transmitter inhibit
control signals are provided for each transmitter.
The receiver section of the each bus converts the 1553 bus
bi-phase data to complementary CMOS / TTL data suitable
for inputting to a Manchester decoder. Each receiver has a
separate enable input which can be used to force the
output of the receiver to a logic "0" (HI-1573) or logic 1 (HI-
1574).
To minimize the package size for this function, the
transmitter outputs are internally connected to the receiver
inputs, so that only two pins are required for connection to
each coupling transformer. For designs requiring
independent access to transmitter and receiver 1553
signals, please contact your Holt Sales representative.
(DS1573 Rev. K)
FEATURES
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April 2007
Compliant to MIL-STD-1553A and B,
ARINC 708A
3.3V single supply operation
Smallest footprint available in 7 mm x 7 mm 44
pin plastic chip-scale package
Less than 0.5W maximum power dissipation
Available in DIP and small outline (ESOIC)
package options
Military processing options
Industry standard pin configurations
HOLT INTEGRATED CIRCUITS
www.holtic.com
HI-1573, HI-1574
3.3V Monolithic Dual Transceivers
PIN CONFIGURATIONS
PIN CONFIGURATIONS
20 Pin Plastic ESOIC - WB package
RXENA 4
RXENB 9
GNDA 5
GNDB 10
VDDA
BUSA 2
BUSA
VDDB 6
BUSB 7
BUSB
RXENA 2
RXENA 4
RXENB 9
20 Pin Ceramic DIP package
GNDA 3
GNDA 4
GNDA 5
VDDB 6
VDDB 7
BUSB 8
BUSB 9
BUSB
BUSB
GNDA 5
GNDB 10
44 Pin Plastic 7mm x 7mm
VDDB 6
VDDA 1
BUSA 2
BUSA
BUSB 7
BUSB
-
10
11
1
Chip-scale package
1
3
8
3
8
1573CDM
1574CDM
1573PSM
1574PSM
1573CDT
1574CDT
1573PST
1574PST
1573CDI
1574CDI
1573PSI
1574PSI
1573PCT
1574PCT
1573PCI
1574PCI
MIL-STD-1553
20
19 TXA
18 TXINHA
17 RXA
16
15
14 TXB
13 TXINHB
12 RXB
11
20
19 TXA
18 TXINHA
17 RXA
16
15
14 TXB
13 TXINHB
12 RXB
11
RXB
TXA
RXA
TXB
33 -
32 -
31 TXINHA
30 RXA
29
28 -
27 -
26
25 TXB
24 TXINHB
23 -
RXA
TXB
TXA
RXA
TXB
RXB
04/07

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hi-1573 Summary of contents

Page 1

... CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic "0" (HI-1573) or logic 1 (HI- 1574). To minimize the package size for this function, the ...

Page 2

... CMOS data at the RXA/B and pins. Each set of receiver outputs can be independently forced TXA The to a logic "0" (HI-1573) or logic “1” (HI-1574) by setting RXENA or RXENB low. BUSA MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2 ...

Page 3

... RECEIVER RXA/B Receive Logic RXA/B Comparator RXENA/B TXA/B TXA/B BUSA/B - BUSA/B Vin (Line to Line RXA/B RXA/B HI-1573, HI-1574 BUSA/B BUSA/B Input Filter Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN RECEIVE WAVEFORMS - EXAMPLE PATTERN HOLT INTEGRATED CIRCUITS ...

Page 4

... Input Level Input common mode voltage Threshold Voltage - Direct-coupled Detect No Detect Theshold Voltage - Transformer-coupled Detect No Detect = HI-1573, HI-1574 RECOMMENDED OPERATING CONDITIONS -0 Supply Voltage -0 +3.6 V VDD....................................... 3.3V... ±5% 10 Vp-p Temperature Range +1.0 A Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C 1.0 W Military Screening..........-55° ...

Page 5

... Note 3. Measured using a 1 MHz sinusoid, 860 mV peak to peak, line to line at point “AT”. Measured from input zero crossing point. TRANSMITTER TXA/B TXA/B TXINHA Point “A “ D Figure 2. Direct Coupled Test Circuits HI-1573, HI-1574 SYMBOL CONDITION D 35 ohm load V OUT (Measured at Point “A “ in Figure 2) 70 ...

Page 6

... Zo) Figure 3. Transformer Coupled Test Circuits HEAT SINK - ESOIC & CHIP-SCALE PACKAGE Both the HI-1573PSI/T/M and HI-1574PSI/T/M use a 20- pin thermally enhanced SOIC package. The HI- 1573PCI/T and HI-1574PCI/T use a plastic chip-scale package. These packages include a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation ...

Page 7

... PART NUMBER PART NUMBER 1573 1574 RECOMMENDED TRANSFORMERS The HI-1573 and HI-1574 transceivers have been characterized for compliance with the electrical require- ments of MIL-STD-1553 when used with the following MANUFACTURER PART NUMBER Premier Magnetics PM-DB2725EX Technotrol TL1553-45 Premier Magnetics PM-DB2702 ...

Page 8

PLASTIC SMALL OUTLINE (ESOIC (Wide Body, Thermally Enhanced) .504 ± .008 (12.79 ± .19) .407 ± .013 Top View (10.325 ± .32) .0165 ± .0035 (.419 ± .089) .050 BSC (1.27) BSC = “Basic Spacing between Centers” ...

Page 9

... PLASTIC CHIP-SCALE PACKAGE .276 BSC (7.00) .276 Top View BSC (7.00) .039 max (1.00) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) PACKAGE DIMENSIONS .203 ± .006 (5.15 ± .15) Electrically isolated heat sink .008 pad on bottom of package. ...

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