hi-1566pst Holt Integrated Circuits, Inc., hi-1566pst Datasheet
hi-1566pst
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hi-1566pst Summary of contents
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... CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic 0 (HI-1565) or logic 1 (HI- 1566). To minimize the package size for this function, the transmitter outputs are internally connected to the receiver inputs, so that only two pins are required for connection to each coupling transformer ...
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... CMOS/TTL data at the RXA/B and output pins. Each set of receiver outputs can be independently forced TXA logic "0" (HI-1565) or logic “1” (HI-1566) by setting RXENA or RXENB low. BUSA MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2 ...
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... RECEIVER RXA/B Receive Logic RXA/B Comparator RXENA/B TXA/B TXA/B BUSA/B - BUSA/B Vin (Line to Line RXA/B RXA/B HI-1565, HI-1566 BUSA/B BUSA/B Input Filter Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN RECEIVE WAVEFORMS - EXAMPLE PATTERN HOLT INTEGRATED CIRCUITS ...
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... Supply Voltage -0 +5.5 V VDD....................................... 5V... ±5% 10 Vp-p Temperature Range +1.0 A Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C 1.0 W Military Screening..........-55°C to +125°C 7mW/°C 275°C for 10 sec. NOTE: ratings or outside recommended operating 175°C conditions may cause permanent damage to the device. These are stress ratings only. Operation -65° ...
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... OUT TEST CONDITIONS From input zero crossing to RXA/B or RXA/B Spacing between RXA/B and RXA/B pulses From RXENA/B rising or falling edge to RXA/B or RXA/B TXA/B, TXA/B to BUSA/B, BUSA/B 35 ohm load 35 ohm load Inhibited output Active output 1:2.5 BUSA/B BUSA/B Isolation Transformer 2.5 Isolation ...
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... HEAT SINK - ESOIC & CHIP-SCALE PACKAGE Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a 20-pin thermally enhanced SOIC package. The HI-1565PCI/T and HI-1566PCI/T use a plastic chip-scale package. These packages include a metal heat sink located on the bottom surface of the device. This heat THERMAL CHARACTERISTICS PART NUMBER PACKAGE STYLE HI-1565PSI / ...
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... -55°C TO +125°C T -55°C TO +125°C M YES PACKAGE DESCRIPTION 44 PIN PLASTIC CHIP-SCALE LPCC (44PCS) not available with ‘M’ flow 20 PIN PLASTIC ESOIC, Thermally Enhanced Wide SOIC w/Heat Sink (20HWE) RXENA = 0 RXENB = 0 RXA RXA RXB RXB ...
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PLASTIC SMALL OUTLINE (ESOIC (Wide Body, Thermally Enhanced) .504 ± .008 (12.79 ± .19) .407 ± .013 Top View (10.325 ± .32) .0165 ± .0035 (.419 ± .089) .050 BSC (1.27) BSC = “Basic Spacing between Centers” ...
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... PLASTIC CHIP-SCALE PACKAGE .276 BSC (7.00) .276 Top View BSC (7.00) .039 max (1.00) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) PACKAGE DIMENSIONS .203 ± .006 (5.15 ± .15) Electrically isolated heat sink .008 pad on bottom of package. ...