MT47H32M16HR-25E IT:F TR Micron Technology Inc, MT47H32M16HR-25E IT:F TR Datasheet - Page 3

• Manufacturer Part Number: MT47H32M16HR-25E IT:F TR
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M16HR-25E IT:F TR

• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 400ps
• Maximum Clock Rate: 800MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 295mA
• Pin Count: 84
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

Contents
State Diagram .................................................................................................................................................. 8
Functional Description ..................................................................................................................................... 9
Functional Block Diagrams ............................................................................................................................. 11
Ball Assignments and Descriptions ................................................................................................................. 13
Packaging ...................................................................................................................................................... 17
Electrical Specifications – Absolute Ratings ..................................................................................................... 20
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 30
AC and DC Operating Conditions .................................................................................................................... 41
ODT DC Electrical Characteristics ................................................................................................................... 42
Input Electrical Characteristics and Operating Conditions ............................................................................... 43
Output Electrical Characteristics and Operating Conditions ............................................................................. 46
Output Driver Characteristics ......................................................................................................................... 48
Power and Ground Clamp Characteristics ....................................................................................................... 52
AC Overshoot/Undershoot Specification ......................................................................................................... 53
Input Slew Rate Derating ................................................................................................................................ 55
Commands .................................................................................................................................................... 68
Mode Register (MR) ........................................................................................................................................ 74
Extended Mode Register (EMR) ....................................................................................................................... 79
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. Q 10/10 EN
Industrial Temperature ................................................................................................................................ 9
Automotive Temperature ........................................................................................................................... 10
General Notes ............................................................................................................................................ 10
Package Dimensions .................................................................................................................................. 17
FBGA Package Capacitance ......................................................................................................................... 19
Temperature and Thermal Impedance ........................................................................................................ 20
I
I
Truth Tables ............................................................................................................................................... 68
DESELECT ................................................................................................................................................. 72
NO OPERATION (NOP) .............................................................................................................................. 73
LOAD MODE (LM) ..................................................................................................................................... 73
ACTIVATE .................................................................................................................................................. 73
READ ......................................................................................................................................................... 73
WRITE ....................................................................................................................................................... 73
PRECHARGE .............................................................................................................................................. 74
REFRESH ................................................................................................................................................... 74
SELF REFRESH ........................................................................................................................................... 74
Burst Length .............................................................................................................................................. 75
Burst Type ................................................................................................................................................. 76
Operating Mode ......................................................................................................................................... 76
DLL RESET ................................................................................................................................................. 76
Write Recovery ........................................................................................................................................... 77
Power-Down Mode .................................................................................................................................... 77
CAS Latency (CL) ........................................................................................................................................ 78
DLL Enable/Disable ................................................................................................................................... 80
Output Drive Strength ................................................................................................................................ 80
DQS# Enable/Disable ................................................................................................................................. 80
RDQS Enable/Disable ................................................................................................................................. 80
Output Enable/Disable ............................................................................................................................... 80
On-Die Termination (ODT) ........................................................................................................................ 81
DD
DD7
Specifications and Conditions ............................................................................................................... 23
Conditions .......................................................................................................................................... 23
DD
Parameters ........................................................................................................ 23
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
© 2004 Micron Technology, Inc. All rights reserved.
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