AD9238BCP40EB Analog Devices Inc, AD9238BCP40EB Datasheet - Page 44

• Manufacturer Part Number: AD9238BCP40EB
• Manufacturer: Analog Devices Inc

Specifications of AD9238BCP40EB

• Lead Free Status / Rohs Status: Not Compliant

AD9238
Figure 57. PCB Bottom-Side Silkscreen
THERMAL CONSIDERATIONS
The AD9238 LFCSP has an integrated heat slug that improves
the thermal and electrical properties of the package when
locally attached to a ground plane at the PCB. A thermal (filled)
via array to a ground plane beneath the part provides a path for
heat to escape the package, lowering junction temperature.
Improved electrical performance also results from the reduction
in package parasitics due to proximity of the ground plane.
Recommended array is 0.3 mm vias on 1.2 mm pitch. θ
=
JA
26.4°C/W with this recommended configuration. Soldering the
slug to the PCB is a requirement for this package.
Figure 58. Thermal Via Array
Rev. B | Page 44 of 48