CL10C101JB8NNNC SAMSUNG, CL10C101JB8NNNC Datasheet - Page 24
![no-image](/images/manufacturer_photos/0/5/577/samsung_sml.jpg)
CL10C101JB8NNNC
Manufacturer Part Number
CL10C101JB8NNNC
Description
MLCC 0603 C0G 100PF 5% 50V
Manufacturer
SAMSUNG
Series
CLr
Datasheet
1.CL10C101JB8NNNC.pdf
(35 pages)
Specifications of CL10C101JB8NNNC
Size
0603
Dielectric
C0G
Tolerance
+/- 5%
Voltage
50V
Thickness
0.80
Electrode/termination/platin
Ni/Cu/Sn 100%
Products
Normal
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CL10C101JB8NNNC
Manufacturer:
SAMSUNG
Quantity:
600 000
Company:
Part Number:
CL10C101JB8NNNC
Manufacturer:
SamsungP
Quantity:
896 000
* THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED
NO
11
12
13
AFTER THE HEAT TREATMENT OF 150 +0/-10℃, 1Hr AND SITTING OF 48±4hr AT ROOM TEMPERATURE & ROOM HUMIDITY.
Multilayer Ceramic Capacitor
TO SOLDERING
RESISTANCE
VIBRATION
HEAT
TEST
SOLDERABILITY
ITEM
WITHSTANDING
CAPACITANCE
CAPACITANCE
APPEARANCE
APPEARANCE
RESISTANCE
RESISTANCE
INSULATION
INSULATION
CLASS Ⅰ
CLASS Ⅱ
CLASS Ⅰ
CLASS Ⅱ
VOLTAGE
Tan δ
Tan δ
Q
Q
MORE THAN 75% OF THE TERMINAL
SURFACE IS TO BE SOLDERED NEWLY,
SO METAL PART DOES NOT COME
OUT OR DISSOLVE
IN PB--FREE PART, MORE THAN 95%
OF THE TERMINAL SURFACE IS TO BE
SOLDERED NEWLY
30 ㎊ AND OVER : Q ≥ 1000
LESS THAN 30 ㎊ : Q ≥ 400+20 × C
TO SATISFY THE SPECIFIED
INITIAL VALUE
TO SATISFY THE SPECIFIED
INITIAL VALUE
TO SATISFY THE SPECIFIED
INITIAL VALUE
NO MECHANICAL DAMAGE SHALL
OCCUR.
CHARACTERISTIC
30 ㎊ AND OVER : Q ≥ 1000
LESS THAN 30 ㎊ : Q ≥ 400+20 × C
CHARACTERISTIC
CLASS Ⅱ
TO SATISFY THE SPECIFIED
INITIAL VALUE
TO SATISFY THE SPECIFIED
INITIAL VALUE
CLASS
CLASS Ⅰ
Ⅱ
CLASS Ⅰ
NO MECHANICAL DAMAGE
SHALL OCCUR
PERFORMANCE
A,B
A,B
F
F
WITHIN ± 2.5% OR
± 0.25 ㎊ WHICHEVER
IS LARGER
WITHIN ± 7.5%
WITHIN ± 20%
WITHIN ± 2.5% OR
± 0.25 ㎊
WHICHEVER
IS LARGER
WITHIN ± 5%
WITHIN ± 20%
CAP. CHANGE
CAP. CHANGE
SOLDER TEMPERATURE : 230 ± 5 ℃
DIP TIME : 3 ± 1 Sec
SOLDER
FLUX
*PB-FREE
SOLDER TEMPERATURE : 260 ± 5 ℃
SOLDER : Sn96.5-3Ag-0.5Cu
Flux : RMA TYPE
DIP TIME : 3 ± 0.1Sec
* PRE-HEATING : AT 80~120 ℃ FOR 10~30SEC.
DIP : SOLDER TEMPERATURE OF
DIP TIME :10 ± 1 SEC.
EACH TERMINATION SHALL BE FULLY
IMMERSED AND PREHEATED
AS FOLLOWING:
MEASURE AT ROOM TEMP. AFTER
COOLING FOR
BENDING SHALL BE APPLIED TO
THE LIMIT(1mm) WITH 0.3mm/SEC.
KEEP THE TEST BOARD AT THE LIMIT POINT
IN 5 SEC., THEN MEASURE CAPACITANCE.
THE ENTIRE FREQUENCY RANGE,
TO 10Hz, SHALL BE TRAVERSED
IN 1 MINUTE.
THIS CYCLE SHALL BE PERFORMED
2 HOURS IN EACH THERE MUTUALLY
PERPENDICULAR DIRECTION,
FROM 10 TO 55Hz AND RETURN
FOR TOTAL PERIOD OF 6 HOURS.
STEP
A,B,C,F
A,B,C,F
CHAR.
CHAR.
1
2
CLASS Ⅰ : 24 ± 2 HOURS
CLASS Ⅱ : 48 ± 4 HOURS
270 ± 5 ℃
: RMA TYPE
: H63A
TEMP.( ℃ )
150~180
10Hz → 55Hz → 10Hz
80~100
FREQUENCY RANGE
TEST CONDITION
TRAVERSED TIME
1 min
(SEC.)
TIME
60
60
- 23 -