CL10C101JB8NNNC SAMSUNG, CL10C101JB8NNNC Datasheet - Page 29

• Manufacturer Part Number: CL10C101JB8NNNC
• Description: MLCC 0603 C0G 100PF 5% 50V
• Manufacturer: SAMSUNG
• Series: CLr

Specifications of CL10C101JB8NNNC

• Size: 0603
• Dielectric: C0G
• Tolerance: +/- 5%
• Voltage: 50V
• Thickness: 0.80
• Electrode/termination/platin: Ni/Cu/Sn 100%
• Products: Normal

Multilayer Ceramic Capacitor
▶ Application Method
▶ Adhesive hardening Characteristics
● Mounting
▶ Mounting Head Pressure
▶ Bending Stress
● Flux
They should be a good insulator.
They should be non-toxic, and not produce harmful gases, nor be harmful when touched.
It is important to use the proper amount of adhesive. Too little and much adhesive will cause
poor adhesion and overflow into the land, respectively.
To prevent oxidation of the terminations, the adhesive must harden at 160 ℃ or less, within
2 minutes or less.
Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum
during mounting.
When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side
of the board. When the MLCCs are mounted onto the other side, it is important to support the
board as shown in the illustration. If the circuit board is not supported, the crack occur to the
ready-installed MLCCs by the bending stress.
Although the solderability increased by the highly-activated flux, increase of activity in flux may
also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended
that a mildly activated rosin flux(less than 0.2% chlorine) be used.
nozzle
force
support pin
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