HI5731BIB-T Intersil, HI5731BIB-T Datasheet - Page 15

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HI5731BIB-T

Manufacturer Part Number
HI5731BIB-T
Description
DAC 12BIT 100MHZ 5.2V 28-SOIC
Manufacturer
Intersil
Datasheet

Specifications of HI5731BIB-T

Settling Time
20ns
Number Of Bits
12
Data Interface
Parallel
Number Of Converters
1
Voltage Supply Source
Analog and Digital, Dual ±
Power Dissipation (max)
650mW
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Die Characteristics
DIE DIMENSIONS
METALLIZATION
Metallization Mask Layout
161.5 mils x 160.7 mils x 19 mils
Type: AlSiCu
Thickness: M1 - 8k
D7
D6
D5
D4
D3
D2
D1
Å
, M2 - 17k
15
D0
D8
Å
D9
D10
D11
HI5731
HI5731
CLK
PASSIVATION
SUBSTRATE POTENTIAL (POWERED UP)
DGND
DV
Type: Sandwich Passivation
Thickness: USG - 8k
V
CC
EED
DGND
Undoped Silicon Glass (USG) + Nitride
Total 12.2k
DV
EE
Å
, Nitride - 4.2k
Å
+ 2k
Å
CTRL OUT
CTRL IN
R
AV
I
I
ARTN
OUT
OUT
SET
EE
Å

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