DSPB56362AG120 Freescale Semiconductor, DSPB56362AG120 Datasheet - Page 111

IC DSP 24BIT AUD 120MHZ 144-LQFP

DSPB56362AG120

Manufacturer Part Number
DSPB56362AG120
Description
IC DSP 24BIT AUD 120MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
Symphony™r
Type
Audio Processorr
Datasheet

Specifications of DSPB56362AG120

Interface
Host Interface, I²C, SAI, SPI
Clock Rate
120MHz
Non-volatile Memory
ROM (126 kB)
On-chip Ram
42kB
Voltage - I/o
3.30V
Voltage - Core
3.30V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
144-LQFP
Device Core Size
24b
Architecture
Modified Harvard
Format
Fixed Point
Clock Freq (max)
120MHz
Mips
120
Device Input Clock Speed
120MHz
Ram Size
42KB
Program Memory Size
90KB
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (min)
3.14V
Operating Supply Voltage (max)
3.46V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Product
DSPs
Data Bus Width
24 bit
Processor Series
DSP563xx
Core
56000
Numeric And Arithmetic Format
Fixed-Point
Instruction Set Architecture
Modified Harvard
Device Million Instructions Per Second
120 MIPS
Maximum Clock Frequency
120 MHz
Program Memory Type
Flash
Data Ram Size
42 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Interface Type
SPI, I2C, ESAI, SHI
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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5.3
Power dissipation is a key issue in portable DSP applications. Some of the factors which affect current
consumption are described in this section. Most of the current consumed by CMOS devices is alternating
current (ac), which is charging and discharging the capacitances of the pins and internal nodes.
Current consumption is described by the following formula:
where:
The maximum internal current (I
on best-case operation conditions, which is not necessarily a real application case. The typical internal
current (I
For applications that require very low current consumption, do the following:
Freescale Semiconductor
For a Port A address pin loaded with 50 pF capacitance, operating at 3.3 V, and with a 100 MHz clock, toggling
at its maximum possible rate (50 MHz), the current consumption is
Consider all device loads as well as parasitic capacitance due to PCB traces when calculating
capacitance. This is especially critical in systems with higher capacitive loads that could create
higher transient currents in the V
All inputs must be terminated (i.e., not allowed to float) using CMOS levels, except for the pins
with internal pull-up resistors (TRST, TMS, DE, TCK, and TDI).
Take special care to minimize noise levels on the V
If multiple DSP56362 devices are on the same board, check for cross-talk or excessive spikes on
the supplies due to synchronous operation of the devices.
RESET must be asserted when the chip is powered up. A stable EXTAL signal should be supplied
before deassertion of RESET.
At power-up, ensure that the voltage difference between the 5 V tolerant pins and the chip V
never exceeds 3.95 V.
C
V
f
Set the EBD bit when not accessing external memory.
Minimize external memory accesses and use internal memory accesses.
Minimize the number of pins that are switching.
Minimize the capacitive load on the pins.
Connect the unused inputs to pull-up or pull-down resistors.
CCItyp
Power Consumption Considerations
= node/pin capacitance
= voltage swing
= frequency of node/pin toggle
) value reflects the average switching of the internal buses on typical operating conditions.
I
=
CCI
50 10
max) value reflects the typical possible switching of the internal buses
Example 1. Current Consumption
×
DSP56362 Technical Data, Rev. 4
CC
12
and GND circuits.
I
×
=
3.3
C V
×
×
50
×
×
f
CCP
10
6
, GND
=
8.25mA
P
, and GND
Power Consumption Considerations
P1
pins.
CC
5-3

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