EP3C55F484C8N Altera, EP3C55F484C8N Datasheet - Page 125

IC CYCLONE III FPGA 55K 484FBGA

EP3C55F484C8N

Manufacturer Part Number
EP3C55F484C8N
Description
IC CYCLONE III FPGA 55K 484FBGA
Manufacturer
Altera
Series
Cyclone® IIIr

Specifications of EP3C55F484C8N

Number Of Logic Elements/cells
55856
Number Of Labs/clbs
3491
Total Ram Bits
2396160
Number Of I /o
327
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
484-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
55856
# I/os (max)
327
Frequency (max)
402MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
55856
Ram Bits
2396160
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
FBGA
No. Of Logic Blocks
3491
Family Type
Cyclone III
No. Of I/o's
327
I/o Supply Voltage
3.3V
Operating Frequency Max
402MHz
Operating Temperature Range
0°C To +85°C
Rohs Compliant
Yes
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2510

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High-Speed I/O Interface
© December 2009
CIII51008-3.2
f
Altera Corporation
This chapter describes the high-speed differential I/O features and resources in the
Cyclone III device family.
High-speed differential I/O standards have become popular in high-speed interfaces
because of their significant advantages over single-ended I/O standards. The Altera
Cyclone
BLVDS, reduced swing differential signaling (RSDS), mini-LVDS, and point-to-point
differential signaling (PPDS).
This chapter contains the following sections:
Cyclone III device family I/Os are separated into eight I/O banks, as shown in
Figure
LVDS, RSDS, mini-LVDS, and PPDS are on the left and right I/O banks. These I/O
standards are also supported on the top and bottom I/O banks using external
resistors. On the left and right I/O banks, some of the differential pin pairs (p and n
pins) of the true output drivers are not located on adjacent pins. In these cases, a
power pin is located between the p and n pins. These I/O standards are also
supported on all I/O banks using two single-ended output with the second output
programmed as inverted, and an external resistor network. True input buffers for
these I/O standards are supported on all I/O banks.
For more information about the location of Cyclone III device family true differential
pins, refer to the
“High-Speed I/O Interface” on page 7–1
“High-Speed I/O Standards Support” on page 7–7
“True Output Buffer Feature” on page 7–15
“High-Speed I/O Timing” on page 7–16
“Design Guidelines” on page 7–17
“Software Overview” on page 7–18
7–1. Each bank has an independent power supply. True output drivers for
®
III device family (Cyclone III and Cyclone III LS devices) supports LVDS,
Cyclone III Devices Pin-Outs
7. High-Speed Differential Interfaces in
the Cyclone III Device Family
on the Altera website.
Cyclone III Device Handbook, Volume 1
®

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